Multitest Experts to Present PCB Pad Wear Analysis Findings at BiTS 2011

Multitest announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present at the upcoming Burn-in and Test Socket Workshop. The event is scheduled to take place March 6-9, 2011 in Mesa, AZ, USA. The presentation "PCB Pad Wear Analysis at 0.4 mm Pitch ― the Story Continues…” will take place on Tuesday, March 8, 2011.

The intent of this presentation is to follow up on the PCB Pad Wear presentation from BiTS 2010. Last year’s presentation focused on the mechanical interaction of various probe tip geometries of socket contacts in 0.8mm pitch, offset PCB pads. This year’s presentation will expand the study to the realm of fine-pitch by studying 0.4 mm pitch pads, with typical via-in-pad construction.

An investigation with results of pad wear with three different spring probe tip styles, as well as socket configurations with various levels of preload resulting in probe chatter will be presented. Additionally, different types of PCB pad finishes will be discussed, as well as pros and cons of the alternative plating formulations with respect to mechanical wear due to spring probes.

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