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Tuesday, May 22, 2012
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NEWS > FEBRUARY 2011

Panasonic Electronic Devices Licenses Multi-Layer Resin Board Technology to AT&S

25 February 2011

Panasonic Electronic Devices Co Ltd and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft announced that they have reached an agreement, under which Panasonic will license its multi-layer resin board technology called ALIVH (Any Layer Interstitial Via Hole) to AT&S. The two companies will also build up collaborative relationships with an eye to developing next generation circuit board technology in order to accelerate business expansion in mobile devices, such as smartphones.

According to the companies, the global mobile phone market is seeing a dramatic shift to smartphones from regular mobile phones. The introduction of Long Term Evolution (LTE) communication services and the anticipated full-fledged spread of e-books are expected to spur the growth of the market. High density and multi-layer circuit boards play a key role in smartphones, which require high speed processing of ever more increasing amount of signals.

Panasonic's ALIVH multi-layer resin board technology enables an IVH structure in all layers to make PCBs suitable for high density and multi-layer applications. The company places high priority on ALIVH products that are essential for the further evolution of sophisticated mobile terminals, such as smartphones. Panasonic said it has been accelerating the global development of this business.

www.ats.net
www.panasonic.net

 
 
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