DEK to Showcase Flexible Print Platforms at Semicon China 2011

DEK is preparing to demonstrate its flexible print platforms for today's demanding back-end wafer level and substrate processes at Semicon China 2011. The event will take place from March 15-17, 2011, at Shanghai New International Expo Center in China.

DEK will feature the Galaxy print platform with wafer transport solution. This system, displayed alongside the CHAD wafer handler, is configured with a precision wafer pallet and high performance heavy pallet rails for wafer level packaging (WLP) applications.

David Foggie, DEK Semicon and Alternative Applications Manager, said: "Semicon China 2011 provides us an excellent opportunity to showcase our cutting-edge technologies to China customers. In addition to its outstanding performance, the DEK-CHAD pairing offers users multi-application capability, which makes the system one of the most cost-effective market-ready wafer level packaging process solutions available."

"Besides, our innovations in handling and tooling, print-head design and process-optimized stencil design, we also maximize accuracy and repeatability when processing singulated substrates presented in industry-standard carriers, strips, or attached to leadframes," Foggie added.

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