Weiner International Associates Completes Tutorial Suite

Executive Associate Dr Karl H Dietz, of Weiner International Associates has completed preparation of the tutorial "HDI, Fine Line Processing". This is the capstone of his new suite of tutorials and seminars for bare board and substrate fabrication. The suite is now offered by Weiner International Associates to individual companies at their facilities as well as to groups of companies and local branches of trade associations at selected locations. The tutorial series is offered individually, in combination or in its entirety. Dr Dietz also provides custom presentations such as "Applications and Development Prospects of New Materials and Substrate Manufacture" or "Image Transfer Technologies".

Dr Dietz has conducted tutorials and seminars at major events globally (CPCA, IPC, JPCA, PCMI, TPCA) as well as at private company meetings throughout Germany, Brazil, Taiwan, China and the United States (e.g., Unimicron, KSG Leiterplatten GmbH, Microelectronica, CCTC and Orbotech). There are eight tutorials that comprise the suite: Prelamination Surface Preparation; Dry Film Resist Lamination and Resist Tenting; Exposure and Exposure - LDI (Laser Direct Imaging) and Other Alternatives To Contact Printing; Plating; Stripping, Environmental and Health Aspects of Dry Film Resist Processing; Photoresist Aqueous Development; Etching; HDI, Fine Line Processing and Related Topics. Additionally, proprietary processes that allow the formation of stacked microvias, core-less structures and "parallel processing" are introduced.

Source: MW Associates