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Compact rework system
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| 26 May 2006 |
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Fineplacer CRS 10
• For small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards
• Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and
connectors), RF-shields, shielding frame, flip chip rework as well as customized applications
• Plug-and-Work design, eliminating the need for cabling
• Better than 10μm placement
accuracy allows the system to be used for components with pitches down to 100 μm
• Large field of view makes it possible to align large components
Finetech Electronic GmbH
www.finetech.de
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