GOEPEL and SPEA Cooperate to Integrate Boundary Scan into Flying Prober

Within the scope of an OEM cooperation, GOEPEL electronic and SPEA developed a professional boundary scan option for the SPEA 4060 Flying Prober test system. According to the companies, this integration provides crucial benefits such as increased test and fault coverage as well as significant time savings in the automatic production process.
The interaction between flying prober and boundary scan is fully automatically controlled, with the integration of the top and bottom probes of the SPEA system in the test run. The boundary scan cells are connected with the 4060 Flying Prober's digital channels via the test points. During the test, the contacting probe works as additional, virtual boundary scan cell in the respective net, e.g. enabling the detection of a non-soldered pin that is connected only with a connector.

"This combination of flying prober and boundary scan fits ideally, in particular for assemblies with BGAs supporting Boundary Scan and a significant percentage of discrete components. The interaction of both systems leads to a considerably higher fault coverage, compared to separated utilisations," explains Alexander Beck, GOEPEL electronic's integration expert. "Especially manufacturer of PCBs with highly limited test access are now able to achieve enormous technological and economic advantages by using such integrated production systems."

Andrea Ganio, Executive Director of SPEA, adds, "The perfectly integrated combination of our flying probe capabilities with the GOEPEL electronic boundary scan measurement module meets the request for high performance digital testing, demonstrating the great results that these complementary techniques give when used together. The joint experience of two leading companies in flying probe and boundary scan testing has brought to a top-class technological solution, providing best test coverage, test time optimization and ease of use."

www.goepel.com
www.spea.com