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Indium's VP of Technology Receives Best Presentation Award at Nepcon China
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| 23 May 2011 |
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Indium Corporation Vice President of Technology Dr Ning-Cheng Lee was recognized for Best Presentation of Technology Conference One at Nepcon China (Shanghai) 2011 by Surface Mount Technology Association (SMTA) China East.
Dr Lee presented Voiding Control for QFN Assembly, which included the challenges and most effective practices for controlling voids during the QFN assembly process. According to Dr Lee, "Voiding behavior of the QFN can be controlled by improved design in the thermal pad, thermal via, and reflow profile." A copy of Dr Lee's paper is available at www.indium.com/techlibrary/whitepapers.
Dr Lee is a soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications.
www.indium.com |
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