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Indium Corporation Technology Experts Presenting at ICEPT-HDP 2011
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| 3 August 2011 |
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Indium Corporation expert Dr Ning-Cheng Lee will present his technical findings at the 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011) August 8-11, in Shanghai, China.
Dr Lee will present A Novel High Melting Lead-Free Mixed Solder Paste System. This paper, which is co-authored by Research Metallurgist Hongwen Zhang, discusses the development of a novel high melting lead-free BiAgX mixed solder paste system, and compares the performance with several representative high lead solder alloys.
Dr Lee will also be presenting the technical poster Fragility Suppression Via BGA with SAC105Ti Ball, which is co-authored by Research Metallurgist Weiping Liu. This poster discusses the drop test performance of different solder combinations.
In addition, Dr Lee will be teaching a professional development course, Achieving High Reliability of Lead-free Soldering and Flip Chip 3D/TSV Packaging and Materials Consideration and chairing the session Packaging Materials and Processes.
www.indium.com |
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