Henkel announced that it has worked with STMicroelectronics to validate the performance of Henkel's Ablestik C100 conductive die attach film materials. The materials were utilized in the production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions. "Because of the importance of electrical and thermal conductivity, we've worked with Henkel to develop a die placement process using its conductive die attach films, as moving to tapebased adhesive materials will guarantee even better workability and in-process control than we currently offer," says Laura Ceriati, STMicroelectronics Corporate Package Development Director for leaded package platforms. www.henkel.com/electronics | 
