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Wednesday, May 23, 2012
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PRINT EDITION > JULY 2011

SOLDERING EQUIPMENT: Vapor phase reflow system

1 July 2011

Consistent, uniform heat transfer for high quality reflow, curing and drying
• Accommodates low volume production and smaller sized products
• Working envelope of 12"L x 10"W x 2.25"H
• Patented palletized conveyor system keeps product horizontal throughout the process
• Features touch screen controls, convected preheat zone, programmable recipes, cooling zone, working fluid auxiliary tank and filter system

R&D Technical Services
www.rdtechnicalservices.com

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