Login
  New Member Sign Up
Members
Log In Log In
Print Subscription Bookmark EMAsia
Click to navigate back to homepage
Wednesday, May 23, 2012
| | | | | | | | |
Go to EM Asia (China)
 
ema-cover
 
 
 
 
 
 
PRINT EDITION > JULY 2011

SOLDERING MATERIALS: Lead-free solder paste

1 July 2011

XF3+
• Accommodates extended reflow profiles with or without the use of nitrogen
• Good wetting on all common pad finishings, yielding shiny joints reminiscent of leaded solders
• Performs better in eliminating voiding when compared to SACalloy
• Provides improved print performance, as well as long stencil life
• Offers a high tack force/time

Cobar Solder Products
www.cobar.com

RELATED ARTICLES

No related articles at the moment.

 
 
ADVERTISEMENT
 
| | | | | | |
Back to top
 
  © 2012 Ten Alps Communications Asia. All rights reserved.
Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.