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Wednesday, May 23, 2012
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PRINT EDITION > JULY 2011

T&M / INSPECTION: Test and qualification kit

1 July 2011

TMV Board
• Drop test lead-free kit designed for 14mm Amkor TMV (through mold via) component
• Eight layer test board is a 3x5 array with 15 component placements per board
• Board is 132 x 77mm in size and 1.0mm thick
• Standard surface finish is OSP
• Test vehicle designed for TMV 620 solder ball 0.4mm pitch bottom component and TMV 200 solder ball 0.5mm top component

Practical Components
www.practicalcomponents.com

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