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Wednesday, May 23, 2012
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PRINT EDITION > JULY 2011

T&M / INSPECTION: High resolution SPI

1 July 2011

Traqu
• 3D inspection system for process optimization, monitoring and sample control
• Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported
• Infrared-interferometric sensor scans any 3D structure, independent of material and surface
• Depending on installed lenses, vertical resolution from 2-200 nm and a horizontal resolution from 1-20 μm can be achieved

Essemtec
www.essemtec.com

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