DEK Receives Two Packaging Awards at Semicon West

DEK again took to the podium at Semicon West event to accept not one, but two Advanced Packaging Awards in recognition of the company’s latest technology innovations. Accepting the awards on behalf of DEK were the company’s CEO, John Hartner, and Americas General Manager, Neil MacRaild.

Taking top honors in the categories of Specialized Advanced Packaging Equipment and Materials and Die Attach Equipment and Materials were DEK’s SinguLign and DirEKt Coat processes -- two recently developed packaging advances designed to provide higher throughput production of next-generation devices. DEK’s SinguLign enables the high accuracy mass imaging of multiple materials such as solder paste, solder spheres, flux and adhesive onto singulated substrates or components directly from the carrier, allowing the accurate processing of known good parts down to 20 mm in size. Enabled by a highly-accurate printing platform, advanced tooling, a carrier and a miniaturized print or ball placement head, repeatable and precise deposits can be applied to parts individually. And, with only known good parts are being processed, throughput and end of the line yield are dramatically improved.

Addressing the demanding requirements of ultra-thin wafer processing, DEK’s DirEKt Coat system delivers an ultra-thin wafer level-coating process for various materials including die attach, epoxies and protective backside coatings. Utilizing a Micron-class Galaxy mass imaging system, a DEK engineered ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the DirEKt Coat process allows for the high-speed, uniform deposition of 25 micron coatings on wafers as thin as 100 microns and up to 300mm in diameter.

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