Login
  New Member Sign Up
Members
Log In Log In
Print Subscription Bookmark EMAsia
Click to navigate back to homepage
Thursday, May 15, 2008
| | | | | | | | |
Go to EM Asia (China)
 
POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
APRIL 2008 CONTENTS
Contents
April 2008
 
 
Click here to subscribe our Free Print Edition Click here to subscribe our
Free Print Edition
Cover Story

Material systems enable high density packaging
EM Asia Comment

Innovate or perish: Lessons from the mobile phone business
Features

Scalable dispensing solutions
Emerging Technologies

Two routes to embedded components
Viewpoint

Christopher J Fussner, President of TransTechnology Pte Ltd
News

Nihon Superior to collaborate with University of Queensland

Compal to shift output to Vietnam

Koh Young opens Japan division; appoints Global Marketing Director

Océ opens technology center in Singapore

Nam Tai to sell JIC Technology

Celestica collaborates with Microsoft on computer architecture research

Pioneer to restructure its display business

Mitsubishi Electric to terminate mobile handset business

AUO unveils “Green Solutions” initiative

Q-Cells to construct solar facility in Malaysia

DEK celebrates its 40th anniversary; appoints process leader in Asia

Sono-Tek creates strategic business units

SEMI establishes global photovoltaic initiative

Assembléon and Valor announce technology partnership

BTU International accelerates growth of its solar energy equipment business

Greenpeace: Vast amounts of hazardous electronic waste unaccounted for

Nepcon China to kick off in Shanghai

IPC signs agreement with Tsinghua University for vocational training program

Zebra to transfer printer assembly operations to Jabil’s China facility

China’s semiconductor market expected to surpass $28 billion in 2011
Manufacturing Products & Equipment

Phase change thermal interface material

Passageway gate system

MSD management system

Fast acting surfactant technology

Fast solder paste and adhesive removal

Modular fluid dispense system

SMT placement platform

Compact thermal profiler

Compact rework system

Site dressing system

High-speed solar-cell metallization platform

Fully automatic screen printer

Flexible reflow oven

Selective soldering system

Lead free soldering alloy

Fully automatic wafer inspection

Solder analysis and identification system

Intelligent tools for boundary scan software

High resolution AOI system

Advanced x-ray inspection system
T&M

Next generation ICT solutions for limited access boards

Solving today’s AOI challenges
News Analysis

Global market for surface mount technology equipment to exceed $5.6 billion by 2010

Manufacturing Insights Asia Pacific releases top 10 supply chain predictions for 2008

Growing demand for consumer electronics driving the outsourcing trend in the electronics industry

PC market to continue double-digit growth despite increasing economic concerns

India PC market crosses 6.5 million shipments mark in 2007

Electronic Business 2007 Top R&D spenders

 
SPONSORED LINKS
Sponsored Links
 
ADVERTISEMENT
 
 
| | | | | | |
Back to top
 
© 2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.