EMAsiaMag.com | Packaging & InterconnectCopyright 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.Henkel announced that it has worked with STMicroelectronics to validate the performance of Henkel's Ablestik C100 conductive die attach film materials. The materials were utilized in the production of ....http://www.emasiamag.com/article-8364-henkelsconductivedieattachfilmsenableleadframepackagescalabilityatstmicroelectronics-Asia.htmlOMRON Corporation announced that the company has launched mass production of a connector using subminiature contacts electroformed through an electroplating process, said to be the first of its kind in ....http://www.emasiamag.com/article-8367-omrondevelopsconnectorusingelectroformingtechnologylaunchesmassproduction-Asia.html3M Co recently added several new equipment in a semiconductor application laboratory it is operating in Yangmei City, Taiwan. In the laboratory`s clean room the company has recently installed wafer support ....http://www.emasiamag.com/article-8370-3mincreasesinvestmentintaiwan-Asia.htmlFinetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including ....http://www.emasiamag.com/article-8240-finetechsupportsuniversitylabsinadvancedresearch-Asia.htmlIPC has released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues ....http://www.emasiamag.com/article-8170-ipcreleasesguidelinesfordesignandassemblyofbottomterminationcomponents-Asia.htmlEngineered Conductive Materials LLC will showcase its conductive stringer attach adhesives at the upcoming 4th International Power Generation Expo. The event is scheduled to take place March 2-4, 2011 ....http://www.emasiamag.com/article-7971-engineeredconductivematerialstoexhibitatpvtokyo2011-Asia.htmlThe World Gold Council (WGC) has published a special issue of Gold Bulletin devoted to the use of gold in electronics. This edition covers current technological uses of the metal such as in gold bonding ....http://www.emasiamag.com/article-7632-worldgoldcouncilexplorestheuseofgoldinelectronics-Asia.htmlATE China 2010, the international event that focuses on industrial assembly machines and technologies in China, will open at Shenzhen Exhibition Center on August 31, 2010. It will exhibit state-of-the-art ....http://www.emasiamag.com/article-7521-atechina2010tokickoffnextweek-Asia.htmlElectronic components distributor Digi-Key Corporation and Harwin announced the two companies have entered into an agreement in which Digi-Key will distribute Harwin's products to customers worldwide. ....http://www.emasiamag.com/article-7506-digikeyandharwinsignglobaldistributionagreement-Asia.htmlPackage-on-package (PoP) component applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. A new ....http://www.emasiamag.com/article-7492-newwebsitededicatedtopackageonpackageassembly-Asia.html