EMAsiaMag.com | Packaging & InterconnectCopyright 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.The SMTA announces that the program for their 21st annual conference, SMTA International, is finalized and available on-line at www.smta.org/smtai. The conference will be held at Disney's Coronado Springs ....http://www.emasiamag.com/article-3703-smtainternationalconferenceprogramfinalized-Asia.htmlIPC and the Jisso International Council (JIC) are sponsoring a technical seminar, Implementing Advanced Interconnect Technology Solutions, May 21–22, 2008, in Atlanta, USA. Hosted by Georgia Institute ....http://www.emasiamag.com/article-3701-ipcandjissointernationalcouncilsponsortechnicalseminar-Asia.htmlAn Evolving Technologies Summit is scheduled during the SMTA’s annual conference, SMTA International, at the Disney's Coronado Springs Resort and Convention Center, Orlando, FL, USA from August 17-21, ....http://www.emasiamag.com/article-3665-smtainternational2008evolvingtechnologiessummitannounced-Asia.htmlIPC — Association Connecting Electronics Industries has announced the release of IPC-7095B, Design and Assembly Process Implementation for BGAs. Implementing ball grid array (BGA) and fine-pitch ball ....http://www.emasiamag.com/article-3664-ipcreleasesrevisionbofipc7095-Asia.htmlIPC — Association Connecting Electronics Industries will bring electronics industry leaders together to discuss and assess key enabling technologies and industry dynamics that are driving advanced packaging ....http://www.emasiamag.com/article-3652-ipcofferslookintofutureadvancedpackagingtechnology-Asia.htmlSanmina-SCI Corporation has announced SuperBC--a new patent pending technology for Buried Capacitance applications in providing bypass capacitance inside silicon chip packages and high-performance PCBs--at ....http://www.emasiamag.com/article-3627-sanminasciannouncesnewtechnologyforchipsubstratesandhighperformancepcbs-Asia.htmlUniversal Instruments announced that it is going to hold a seminar and a practical workshop on system-in-package technologies in April in its Advanced Process Laboratory in Shanghai to share its latest ....http://www.emasiamag.com/article-3598-universalinstrumentstoholdseminarandworkshoponsysteminpackagetechnologiesinshanghai-Asia.htmlECWC11, a global convention sponsored by World Electronic Circuits Council (WECC) held every three years, kicked off in Shanghai on March 17 at the Everbright Convention and Exhibition International Hotel. ....http://www.emasiamag.com/article-3497-ecwc11opensinshanghai-Asia.htmlUniversal Instruments announces that it will demonstrate the state-of-the-art surface mounting technologies, including system-in-package (SiP) applications, odd-form components solutions and high speed ....http://www.emasiamag.com/article-3490-universalinstrumentstodemonstratelatesttechnologiesatnepconchina2008-Asia.htmlIPC—Association Connecting Electronics Industries announced the 12 products that will be featured in the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo, APEX and the Designers ....http://www.emasiamag.com/article-3478-ipcinnovativetechnologycenterwinnersannounced-Asia.html