EMAsiaMag.com | Packaging & InterconnectCopyright 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.KIC announces that MB (Marybeth) Allen will present a paper at the European and International Electronics Assembly Reliability Summit in Tallinn, Estonia from October 22-24, 2008. The paper focuses on ....http://www.emasiamag.com/article-4585-kictopresentpaperateuropeanelectronicsassemblyreliabilitysummit-Asia.htmlEndicott Interconnect Technologies Inc (EI) announced a senior management appointment as part of the strategy to drive operational effectiveness. Jennifer de Souza has been promoted to the position of ....http://www.emasiamag.com/article-4492-endicottinterconnecttechnologiesnamesvicepresidentofsupplychainmanagement-Asia.htmlTyco Electronics Ltd announced that the company has appointed Rob Shaddock to the newly created role of Senior Vice President and Chief Technology Officer (CTO), effective September 15. He will report ....http://www.emasiamag.com/article-4434-tycoelectronicsappointschieftechnologyofficer-Asia.htmlKulicke & Soffa Industries Inc (K&S) has announced that the company has entered into definitive agreements to acquire substantially all of the assets of Orthodyne Electronics Corporation, a supplier of ....http://www.emasiamag.com/article-4129-kulickesoffaannouncesagreementstoacquireorthodyneelectronicsanddivestitswirebusinessunittoheraeusgmb-Asia.htmlBTU International Inc, a supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announced that it received in the past week two awards at the ....http://www.emasiamag.com/article-4096-awardwinnersatsemiconwestexhibitionannouncements-Asia.htmlDEK announces that its latest advance stencil technology, VectorGuard Platinum, was introduced last week at Semicon West and earned an Advanced Packaging Award. According to the company, VectorGuard Platinum ....http://www.emasiamag.com/article-4088-lateststenciltechnologyfromdekearnsadvancedpackagingaward-Asia.htmlVertical Circuits Inc (VCI), a supplier of advanced 3D die-level interconnect solutions, announced its recognition of Asymtek, a Nordson company and provider of dispensing, coating and jetting technologies, ....http://www.emasiamag.com/article-4069-verticalcircuitsandasymtekenablenextgeneration3dinterconnecttechnology-Asia.htmlTanaka Denshi Kogyo KK (Tokyo), a manufacturer of bonding wires, announced that it will substantially expand the production of copper bonding wires with good electrical conductivity and mechanical properties ....http://www.emasiamag.com/article-4064-tanakadenshikogyotosubstantiallyincreaseproductionofcopperbondingwiresasgoldpricescontinuetorise-Asia.htmlMolex Incorporated announced that it has developed a new surface mount technology (SMT) attach method that features greater fatigue strength and lower applied costs compared to traditional SMT mounting ....http://www.emasiamag.com/article-4050-molexannouncesdevelopmentofnewsmtattachmethod-Asia.htmlMentor Graphics Corporation announced the publication of a new book written by Charles Pfeil, Engineering Director of Mentor’s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design ....http://www.emasiamag.com/article-3958-mentorgraphicspublishesnewtechnologybookonbgarouting-Asia.html