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| Manufacturing Products & Equipment, Dispensing Technology - Nov 2006 |
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| Others, Dispensing Technology - 01 Nov 2006 |
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| SC-400 PreciseCoat • Conformal coating jet for applying coating materials to substrates with high-component density • Uses a needle design with noncontact jetting action and fast pulse-width modulate... |
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| News, Dispensing Technology - 19 Oct 2006 |
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| Rohm and Haas Company plans to invest approximately $19M to build a manufacturing facility in Querétaro, Mexico for the production of emulsion polymers and poly-acrylates, used in several markets incl... |
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| News, Dispensing Technology - 15 Oct 2006 |
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| Indium Corporation announces an expansion of its sales efforts in France with the addition of Accelonix Group, its newest distributor. Accelonix is responsible for selling Indium Corporation’s extensi... |
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| News, Dispensing Technology - 10 Oct 2006 |
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| After the success of International Lead-Free Manufacturing Technology Seminar 2005, The 2nd International Lead-Free Manufacturing Technology Seminar will be held on Oct.16, 2006, at the China Hi-Tech ... |
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| News, Dispensing Technology - 04 Oct 2006 |
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| Kester will provide lead-free resources, technologies and products at the upcoming GlobalTronics exhibition, scheduled to take place October 10-13, in Suntec Singapore. The company’s global lead-free ... |
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| News, Dispensing Technology - 03 Oct 2006 |
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| Indium Corporation hosted its 4th Annual Global Technical Summit for their Technical Support and Applications Engineers in Clinton, New York, September 11-15th. Over 40 attendees from Asia, Europe, Me... |
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| Top News, Dispensing Technology - 01 Oct 2006 |
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| Rohm and Haas Adhesives and Sealants will implement a 10 -15% price increase for acrylic, vinyl acrylic and styrene acrylic emulsion and solution polymer products sold to the pressure sensitive, const... |
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| Others, Dispensing Technology - 01 Sep 2006 |
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| Axiom X-1022 • Increases the number of units per hour (UPH) produced in high volume semiconductor applications such as flip chip and chip scale package (CSP) underfill • Dual-lane capability allows u... |
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| Others, Dispensing Technology - 14 Aug 2006 |
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| Servo-driven system designed for precision processes Feature powerful, easy-to-use proprietary software and a graphics user interface that allows for intuitive programming and control Placement accur... |
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