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| Others, Dispensing Technology - 27 Oct 2005 |
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| Champion 6809 Servo-driven system designed for precision processes Feature powerful, easy-to-use proprietary software and a graphics user interface that allows for intuitive programming and control In... |
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| Others, Dispensing Technology - 05 Jul 2005 |
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| Viscosity Control System Combines a heated, recirculating fluid circuit with close-range temperature monitoring to keep the coating process consistent and stable Solvent usage may be reduced, resultin... |
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| Others, Dispensing Technology - 05 Jul 2005 |
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| EUV-700 Conveyorized UV curing station that incorporates Fusion F300 version “D” lamps Station has a standard focal distance of 2.1" above the product, which produces a 1" wide curing zone Lamp housin... |
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| Others, Dispensing Technology - 05 Jul 2005 |
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| CA-5200 High electrical and thermal conductivity Low resistance Favorable cure profile of 150ºC for 15 minutes Electrical stability after 1,000 hours at 85%RH/85ºC No popcorning, delamination, or need... |
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| Others, Dispensing Technology - 05 Jul 2005 |
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| Europa Cycle time: 4 seconds with high throughput conveyor Paste on pad repeatability: 2cpk at ± 20 µm Optimized printer frame improves accuracy and repeatability of machine and processes Range of boa... |
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| Others, Dispensing Technology - 07 Mar 2005 |
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| DispenseMate 550 Small footprint Flexible for many dispensing operations FmNT software Digital gages for high accuracy and easy set-up Automatic Pattern Recognition available CAD Import available Scal... |
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| Others, Dispensing Technology - 07 Jan 2005 |
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| SLF DesiMax SLF Sorbent Tape protect sensitive electronic components from moisture Absorb trace amounts of moisture over long periods of time Dust-free Bends to accommodate curves and corners Safegua... |
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| Others, Dispensing Technology - 08 Nov 2004 |
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| c3M9719 Conductive fibers extend above the adhesive, ensuring a solid electrical connection between substrates Wiping action of the conductive fibers creates good electrical contact High temperature d... |
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| Others, Dispensing Technology - 08 Nov 2004 |
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| RFID Full 20" wide web process capability 12-micron placement repeatability +/- 3 sigma (process dependent) Passive or active designs Direct die pick from wafer down to .008" Capable of tape and reel ... |
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| Others, Dispensing Technology - 12 Jul 2004 |
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| DispenseMate D550 Small footprint; flexible and scalable Benchtop format; targeted at batch processing or prototyping Recommended for solder pastes, surface mount adhesives and bonding Optional featur... |
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