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Thursday, January 8, 2009
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SOLDERING MATERIALS   |   PAGE 16
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Indium Corp’s VP Launch Knowledge Sharing Tour

News, Soldering Materials - 12 Apr 2007
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in ...
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Cobar Group Launches New Web Site

News, Soldering Materials - 12 Apr 2007
Cobar BV, a global supplier of solder pastes, fluxes, and other electronics soldering materials, announces the launch of its new web site. According to Cobar, the new web site is comprehensive, easy t...
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Indium Has New VP for Solder Products Unit

News, Soldering Materials - 10 Apr 2007
Indium Corporation announces the promotion of Ross Berntson to Vice President of their Solder Products Business Unit. Ross is now responsible for product management of Indium’s line of solder material...
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ELFNET Publishes Lead-Free Soldering Status Report 2006

Environmental Compliance, Soldering Materials - 09 Apr 2007
The European Lead Free soldering NETwork (ELFNET) has published its third and last annual report on the implementation status of lead-free soldering technology in Europe. The analysis is based on surv...
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Lenovo Tops Greenpeace Ranking

Top News, Soldering Materials - 05 Apr 2007
The latest Greenpeace ranking of electronic manufacturers' recycling and toxic content policies has a couple of surprises: a previously low ranked Chinese company leaps to the number one spot, and App...
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Kester Increases Prices on Silver- and Tin-Bearing Solder Paste Products

News, Soldering Materials - 04 Apr 2007
Kester announces a surcharge on its line of silver- and tin-containing solder paste products. The price increase will take effect 30 days from customer notification. Since January 2006, the cost of ti...
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Indium Corporation Adds Surcharge on Silver- and Tin-containing Products

News, Soldering Materials - 04 Apr 2007
Indium Corporation is announcing a surcharge on its silver- and tin-containing solder paste products, effective immediately. Since January of 2006 tin has increased from approximately US$3.36/lb to $6...
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Balver Zinn and Cobar Group to Merge

News, Soldering Materials - 20 Mar 2007
Balver Zinn in Balve, Germany and the Cobar group in Breda, Holland announced the signature of a Letter of Intent relating to Cobar joining the Balver Zinn Group. The conclusion of the agreement is ex...
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IPC to Host Numerous Events in Asia

News, Soldering Materials - 04 Mar 2007
IPC — Association Connecting Electronics Industries announces that it will host conferences, seminars and workshops in Asia throughout the months of March, April, May and June 2007. The following even...
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IPC to Co-Host Shanghai International SMT Conference and Workshops

News, Soldering Materials - 01 Mar 2007
IPC — Association Connecting Electronics Industries announces that it will co-host the17th Shanghai International SMT High-Level Conference Lead-Free Manufacture Conference and Workshops on April 24-2...
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