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| News, Soldering Materials - 15 Feb 2008 |
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| With environmental regulations impacting the electronic interconnect industry from all corners of the world, IPC — Association Connecting Electronics Industries announces a number of environment, heal... |
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| News, Soldering Materials - 12 Feb 2008 |
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| Delphi Corporation announced that Richard D Parker, Lead Technologist for Advanced Assembly Technologies at Delphi Electronics & Safety Division, has recently completed co-editing a book on lead-free ... |
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| Environmental Compliance, Soldering Materials - 11 Feb 2008 |
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| The EC (European Commission) is set to adjust the EU (European Union) ROHS (restriction-of-hazardous-substances) directive this year to reflect additional substances and changes to exemptions. ROHS is... |
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| Environmental Compliance, Soldering Materials - 07 Feb 2008 |
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| It’s not clear what the right metaphor is for choosing between regulation under Restriction on Hazardous Substances (ROHS) or REACH (Registration, Evaluation and Authorization of Chemicals) … Is advoc... |
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| News, Soldering Materials - 07 Feb 2008 |
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| Indium Corporation announces that its newest facility, scheduled to start processing in May 2008, will reclaim indium metal from indium-tin oxide (ITO), indium-zinc oxide (IZO), and related indium oxi... |
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| News, Soldering Materials - 05 Feb 2008 |
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| Indium Corporation announces that three of its technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senio... |
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| News, Soldering Materials - 05 Feb 2008 |
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| Cobar Europe BV announces that its Managing Director, Eli Westerlaken, will present a technical paper at IPC Printed Circuits Expo, APEX & the Designers Summit, April 1 - 3, 2008, in Las Vegas, NV, US... |
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| News, Soldering Materials - 05 Feb 2008 |
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| IPC — Association Connecting Electronics Industries has announced the release of Revision B of IPC-7711/7721, "Rework, Modification and Repair of Electronic Assemblies". The revision involved a comple... |
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| News, Soldering Materials - 04 Feb 2008 |
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| FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C lead-free products paste at the upcoming IPC International... |
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| News, Soldering Materials - 30 Jan 2008 |
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| Henkel Adhesives Technologies India Pvt. Ltd. announced that it has started operations at its Pune facility for lead free solder paste blending manufacturing. Henkel’s facility at Pune was expanded la... |
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