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Sunday, October 12, 2008
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POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
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SOLDERING MATERIALS   |   PAGE 5
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CeBIT Talks Green, But The Industry Has Some Way To Go, Says Greenpeace Survey

Top News, Soldering Materials - 07 Mar 2008
The Sony Vaio TZ11 notebook, the Sony Ericsson T650i mobile phone and the Sony Ericsson P1i PDA come out on top in Greenpeace's "Searching for Greener Electronics" survey, released at CeBIT. But, the ...
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Flextronics and Nokia Recognized for Excellence in Lead Free Electronics Assembly in Asia

News, Soldering Materials - 06 Mar 2008
IPC — Association Connecting Electronics Industries has announced its first two certifications for Lead Free Electronics Assembly Process Capability in Asia. Flextronics Industrial, a market segment o...
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No-Clean flux

Manufacturing Products & Equipment, Soldering Materials - Mar 2008
NC162 SN100C• Third-generation liquid flux developed in response to the need for a high-activity halide-free no-clean alloy• Works especially well with SN100C Sn/Cu/Ni+Ge lead free alloy• Well-suited ...
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Nihon Superior to Contribute Paper on Lead-Free Solder Properties at APEX 2008

News, Soldering Materials - 27 Feb 2008
Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, “Properties that are Important in a Lead-fr...
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IPC Signs Agreement with Tsinghua University for Vocational Training Program

News, Soldering Materials - 25 Feb 2008
IPC — Association Connecting Electronics Industries announced a new initiative with Tsinghua University in Beijing to develop a skill development program for electronics assembly. The program will be ...
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Next Generation of Environmental Regulations to be Assessed at APEX 2008

News, Soldering Materials - 15 Feb 2008
With environmental regulations impacting the electronic interconnect industry from all corners of the world, IPC — Association Connecting Electronics Industries announces a number of environment, heal...
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Delphi Technologist Plays Key Role in New Book on Lead-Free Electronics

News, Soldering Materials - 12 Feb 2008
Delphi Corporation announced that Richard D Parker, Lead Technologist for Advanced Assembly Technologies at Delphi Electronics & Safety Division, has recently completed co-editing a book on lead-free ...
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EU ROHS Exemption, Definition Changes to Impact Restricted Substances, Design Requirements

Environmental Compliance, Soldering Materials - 11 Feb 2008
The EC (European Commission) is set to adjust the EU (European Union) ROHS (restriction-of-hazardous-substances) directive this year to reflect additional substances and changes to exemptions. ROHS is...
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Dealing With The Devil: Could REACH Be Better Than ROHS?

Environmental Compliance, Soldering Materials - 07 Feb 2008
It’s not clear what the right metaphor is for choosing between regulation under Restriction on Hazardous Substances (ROHS) or REACH (Registration, Evaluation and Authorization of Chemicals) … Is advoc...
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Indium Corporation Adds Reclaim Capacity with New Facility in the Republic of Korea

News, Soldering Materials - 07 Feb 2008
Indium Corporation announces that its newest facility, scheduled to start processing in May 2008, will reclaim indium metal from indium-tin oxide (ITO), indium-zinc oxide (IZO), and related indium oxi...
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