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Friday, December 5, 2008
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POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
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SOLDERING MATERIALS   |   PAGE 7
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Dealing With The Devil: Could REACH Be Better Than ROHS?

Environmental Compliance, Soldering Materials - 07 Feb 2008
It’s not clear what the right metaphor is for choosing between regulation under Restriction on Hazardous Substances (ROHS) or REACH (Registration, Evaluation and Authorization of Chemicals) … Is advoc...
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Indium Corporation Adds Reclaim Capacity with New Facility in the Republic of Korea

News, Soldering Materials - 07 Feb 2008
Indium Corporation announces that its newest facility, scheduled to start processing in May 2008, will reclaim indium metal from indium-tin oxide (ITO), indium-zinc oxide (IZO), and related indium oxi...
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Indium Corporation’s Technology Experts Presenting at APEX

News, Soldering Materials - 05 Feb 2008
Indium Corporation announces that three of its technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senio...
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Cobar to Present Paper on SN100C Flux Systems Development at APEX 2008

News, Soldering Materials - 05 Feb 2008
Cobar Europe BV announces that its Managing Director, Eli Westerlaken, will present a technical paper at IPC Printed Circuits Expo, APEX & the Designers Summit, April 1 - 3, 2008, in Las Vegas, NV, US...
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IPC Releases Revision B of Lead Free Support and Inspection Guidelines for Repairs and Modifications

News, Soldering Materials - 05 Feb 2008
IPC — Association Connecting Electronics Industries has announced the release of Revision B of IPC-7711/7721, "Rework, Modification and Repair of Electronic Assemblies". The revision involved a comple...
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FCT Solder to Display at IPC International Conference on Flexible Circuits 2008

News, Soldering Materials - 04 Feb 2008
FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C lead-free products paste at the upcoming IPC International...
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Henkel’s Solder Paste Manufacturing Capacity in Pune Operational

News, Soldering Materials - 30 Jan 2008
Henkel Adhesives Technologies India Pvt. Ltd. announced that it has started operations at its Pune facility for lead free solder paste blending manufacturing. Henkel’s facility at Pune was expanded la...
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Advanced Technologies and Eco-Compliance to Headline IPC Professional Development Program at APEX 2008

News, Soldering Materials - 28 Jan 2008
IPC has announced that leading experts from around the world will convene in Las Vegas to share the latest findings on challenges facing the electronic interconnect industry as part of the professiona...
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IPC Urges European Commission to Aim for Science-Based Regulations

Environmental Compliance, Soldering Materials - 22 Jan 2008
The Government Relations and Environment, Health and Safety Committees of IPC — Association Connecting Electronics Industries announce that they have submitted comments to the European Commission revi...
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Cookson Electronics Names Global Director - Customer Technical Support

News, Soldering Materials - 22 Jan 2008
Cookson Electronics has named Paul Lotosky Global Director - Customer Technical Support. He will lead the coordination of the Alpha global customer technical support efforts as they relate to optimizi...
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