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Sunday, July 6, 2008
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POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
T&M/INSPECTION   |   PAGE 4
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High resolution AOI system

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
Flex Ultra HR • 5.0 megapixel camera technology allowing for inspection of 01005 components • Suitable for inspection in assembly lines producing memory, notebook PCBs, mobile phones and automotive e...
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Intelligent tools for boundary scan software

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
System Cascon • Enhances the interaction between boundary scan tools in flying probe testers • New control algorithm implemented in all Automatic Test Program Generation (ATPG) tools and Pin Fault Di...
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Solder analysis and identification system

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
LeadTracer-RoHS • Accurately identifies all solder alloys within minutes • Performs “solder pot” analysis allowing users to track “changes” in their process • Addresses various potential “weak links” ...
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Fully automatic wafer inspection

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
MX2000IR • For inspecting medium and large lots in semiconductor manufacture • Application scope includes MEMS, wafer bonds and flip chips, as well as photovoltaic products • Wafers are loaded for ins...
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FCT Assembly Implements Spark OES Technology

News, T&M/Inspection - 26 Mar 2008
FCT Assembly (FCTA) announces the acquisition of a Spark OES Analyzer (Optical Emission Spectroscopy) to its analytical lab, which is located in Greeley, Colo., USA. According to FCTA, the OES analyze...
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Agilent Technologies to Debut New Line-Up of Manufacturing Test Products at 2008 APEX Conference

News, T&M/Inspection - 25 Mar 2008
Agilent Technologies Inc. announced that it will demonstrate its latest manufacturing test solutions at the 2008 APEX Conference and Exhibition in Las Vegas, USA, April 1-3. "In the near future, the m...
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Everett Charles Technologies to Participate in the Test and Inspection Summit Forum at APEX 2008

News, T&M/Inspection - 24 Mar 2008
Everett Charles Technologies (ECT) announces its upcoming participation in the Test and Inspection Summit sponsored by Test & Measurement World magazine during the IPC/APEX exhibition and conference, ...
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Valor Establishes Technology Partnership with Nagoya Electric

News, T&M/Inspection - 19 Mar 2008
Valor Computerized Systems Ltd., a global provider of productivity-enhancing software solutions for the electronics industry, has established a technological partnership agreement with Nagoya Electric...
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YESTech Moves to New China Facility, Hosts Advanced Technology Day

News, T&M/Inspection - 18 Mar 2008
YESTech Inc., a provider of yield enhancement solutions for electronics manufacturers, has announced the opening of its' new location in Shanghai, China. The offices will be co-located in the expansiv...
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Koh Young Opens Japan Sales, Service Division

News, T&M/Inspection - 12 Mar 2008
3D inspection technology company Koh Young announces the establishment and opening of a sales and service division in Japan, Japan Koh Young Company Limited (JKY). According to the company, the branch...
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