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| Viscom AG and CyberOptics Corp jointly announce an OEM agreement to equip Viscom's SPI inspection systems product line with CyberOptics' 3D SPI sensor technology. The development and supply agreement ... |
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| News, T&M/Inspection - 05 Apr 2011 |
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| Over the past few years, pad cratering has become a vexing problem in lead free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the d... |
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| News, T&M/Inspection - 31 Mar 2011 |
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| Koh Young announces the delivery of their 2000th in-line solder paste inspection (SPI) system to Denso Corporation. Denso is a supplier of advanced automotive technology, systems and components for th... |
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| News, T&M/Inspection - 18 Mar 2011 |
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| Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP family of flat technology pogo pins in its distributor, Tronic Electronics HK Ltd's booth... |
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| News, T&M/Inspection - 07 Mar 2011 |
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| GOEPEL electronic has developed special VarioTAP IPs for testing VORTEX x86 chip series in cooperation with the Taiwanese Company DMP. The solution enables the utilization of dynamic processor emulati... |
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| News, T&M/Inspection - 03 Mar 2011 |
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| GOEPEL electronic introduces PicoTAP, said to be the world’s smallest JTAG/boundary scan controller with single TAP interface. The new and handy solution (matchbox size) has been designed for simple b... |
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| News, T&M/Inspection - 25 Feb 2011 |
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| Everett Charles Technologies' Contact Products Group (CPG) has been awarded US Patent Number: 7,862,391 for its ZIP family of flat technology pogo pins. Bud Fabian, ECT CPG President, said, "We are pl... |
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| News, T&M/Inspection - 24 Feb 2011 |
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| CyberOptics Corporation introduces its new Process Monitor SPC Software. The new interactive software enables users to efficiently manage production. According to the company, Process Monitor includ... |
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| News, T&M/Inspection - 21 Feb 2011 |
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| Multitest announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present at the upcoming Burn-in and Test Socket Workshop. The event is scheduled to take pla... |
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| News, T&M/Inspection - 03 Feb 2011 |
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| Multitest announces that Marcus Frey, Material Engineer, will present the paper “Contact Force Change as a Measure for Current Carrying Capability” at the upcoming Burn-in and Test Socket Workshop (Bi... |
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| News, T&M/Inspection - 01 Feb 2011 |
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