Login
  New Member Sign Up
Members
Log In Log In
Print Subscription Bookmark EMAsia
Click to navigate back to homepage
Thursday, February 9, 2012
| | | | | | | | |
Go to EM Asia (China)
 
ema-cover
 
 
 
 
 
 
T&M/INSPECTION   |   PAGE 5


Viscom, CyberOptics Cooperate on 3D Solder Paste Inspection Sensor Technology

Viscom AG and CyberOptics Corp jointly announce an OEM agreement to equip Viscom's SPI inspection systems product line with CyberOptics' 3D SPI sensor technology. The development and supply agreement ...
News, T&M/Inspection - 05 Apr 2011

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Over the past few years, pad cratering has become a vexing problem in lead free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the d...
News, T&M/Inspection - 31 Mar 2011

Koh Young Marks Delivery of 2000th SPI System

Koh Young announces the delivery of their 2000th in-line solder paste inspection (SPI) system to Denso Corporation. Denso is a supplier of advanced automotive technology, systems and components for th...
News, T&M/Inspection - 18 Mar 2011

ECT’s CPG to Exhibit at Semicon China 2011

Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP family of flat technology pogo pins in its distributor, Tronic Electronics HK Ltd's booth...
News, T&M/Inspection - 07 Mar 2011

GOEPEL and DMP Cooperate on New Test Strategies

GOEPEL electronic has developed special VarioTAP IPs for testing VORTEX x86 chip series in cooperation with the Taiwanese Company DMP. The solution enables the utilization of dynamic processor emulati...
News, T&M/Inspection - 03 Mar 2011

GOEPEL Introduces 'World's Smallest' JTAG/Boundary Scan Controller

GOEPEL electronic introduces PicoTAP, said to be the world’s smallest JTAG/boundary scan controller with single TAP interface. The new and handy solution (matchbox size) has been designed for simple b...
News, T&M/Inspection - 25 Feb 2011

Everett Charles Technologies Receives Patent for Flat Technology Pogo Pins

Everett Charles Technologies' Contact Products Group (CPG) has been awarded US Patent Number: 7,862,391 for its ZIP family of flat technology pogo pins. Bud Fabian, ECT CPG President, said, "We are pl...
News, T&M/Inspection - 24 Feb 2011

CyberOptics Updates Statistical Process Control Software

CyberOptics Corporation introduces its new Process Monitor SPC Software. The new interactive software enables users to efficiently manage production. According to the company, Process Monitor includ...
News, T&M/Inspection - 21 Feb 2011

Multitest Experts to Present PCB Pad Wear Analysis Findings at BiTS 2011

Multitest announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present at the upcoming Burn-in and Test Socket Workshop. The event is scheduled to take pla...
News, T&M/Inspection - 03 Feb 2011

Multitest to Discuss Contact Force Change at BiTS 2011

Multitest announces that Marcus Frey, Material Engineer, will present the paper “Contact Force Change as a Measure for Current Carrying Capability” at the upcoming Burn-in and Test Socket Workshop (Bi...
News, T&M/Inspection - 01 Feb 2011
Previous   1    2    3    4    [5]    6    7    8    Next
 
 
ADVERTISEMENT
 
| | | | | | |
Back to top
 
  © 2012 Ten Alps Communications Asia. All rights reserved.
Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.