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Friday, December 5, 2008
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POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
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T&M/INSPECTION   |   PAGE 6
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ViTechnology and Synapse Imaging Sign Partnership on 3D SPI Systems

News, T&M/Inspection - 07 Apr 2008
ViTechnology announced the signature of a partnership with Korean Company Synapse Imaging, specialized in 3D optical inspection. Synapse Imaging and Vi Technology will work in partnership to offer an ...
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Nordson Corporation Names Steven Kew to Lead Subsidiary Dage Holdings

News, T&M/Inspection - 07 Apr 2008
Nordson Corporation has announced the appointment of Steven Kew as Chief Executive of its subsidiary Dage Holdings, effective April 1. Kew replaces retiring Dage Chief Executive Geraint Rees. Prior to...
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iNEMI Launches New Collaborative Efforts

News, T&M/Inspection - 04 Apr 2008
The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on identifying and closing technology gaps, is organizing several new efforts to help industry collab...
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iNEMI Launches New Collaborative Efforts

Top News, T&M/Inspection - 04 Apr 2008
The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on identifying and closing technology gaps, is organizing several new efforts to help industry collab...
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GOEPEL Demonstrates SCANFLEX Boundary-Scan Platform Integration on Takaya Flying Prober at APEX

News, T&M/Inspection - 04 Apr 2008
GOEPEL electronic and Texmac announce that they have demonstrated a successful integration of GOEPEL's CASCON GALAXY software and SCANFLEX hardware into the Takaya APT-9411 flying-probe system at the ...
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Advanced x-ray inspection system

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
Revolution • Enhanced viewing capabilities with added Quad View facility and dual LCD monitors • Quad View facility allows 4 images to be displayed at once which enables a more thorough inspection of...
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High resolution AOI system

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
Flex Ultra HR • 5.0 megapixel camera technology allowing for inspection of 01005 components • Suitable for inspection in assembly lines producing memory, notebook PCBs, mobile phones and automotive e...
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Intelligent tools for boundary scan software

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
System Cascon • Enhances the interaction between boundary scan tools in flying probe testers • New control algorithm implemented in all Automatic Test Program Generation (ATPG) tools and Pin Fault Di...
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Solder analysis and identification system

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
LeadTracer-RoHS • Accurately identifies all solder alloys within minutes • Performs “solder pot” analysis allowing users to track “changes” in their process • Addresses various potential “weak links” ...
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Fully automatic wafer inspection

Manufacturing Products & Equipment, T&M/Inspection - Apr 2008
MX2000IR • For inspecting medium and large lots in semiconductor manufacture • Application scope includes MEMS, wafer bonds and flip chips, as well as photovoltaic products • Wafers are loaded for ins...
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