Login
  New Member Sign Up
Members
Log In Log In
Print Subscription Bookmark EMAsia
Click to navigate back to homepage
Friday, December 5, 2008
| | | | | | | | |
Go to EM Asia (China)
 
POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
SOLDERING EQUIPMENT   |   PAGE 3
Sponsored Links

BTU Reports Record Breaking Order from Leading Semiconductor Company

News, Soldering Equipment - 12 Mar 2008
BTU International, a supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announced the receipt of the largest single Pyramax order in co...
Read Full Story

IPC Innovative Technology Center Winners Announced

News, Soldering Equipment - 11 Mar 2008
IPC—Association Connecting Electronics Industries announced the 12 products that will be featured in the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo, APEX and the Designer...
Read Full Story

SEHO to Present New Reflow Technology at APEX

News, Soldering Equipment - 07 Mar 2008
SEHO Systems, one of the leading manufacturers of soldering systems, is contributing a paper, "New Technology to Meet Challenging Reflow Requirements", to the technical conference at IPC Printed Circu...
Read Full Story

Which is Best: Pre- or Post- Reflow AOI? Landrex, Imagen to Present Both Arguments at APEX

News, Soldering Equipment - 05 Mar 2008
Rarely do PCB manufacturers have the resources to purchase an inspection machine for every stage of the manufacturing process. As a result, they have to decide whether to deploy AOI prior to the reflo...
Read Full Story

Reflow soldering system

Manufacturing Products & Equipment, Soldering Equipment - Mar 2008
MR933 • Employs an efficient and powerful forced convection heat transfer module design with precision profiling control • Lower machine set points—for minimal Delta-T across the board—and optimized ...
Read Full Story

IPC Signs Agreement with Tsinghua University for Vocational Training Program

News, Soldering Equipment - 25 Feb 2008
IPC — Association Connecting Electronics Industries announced a new initiative with Tsinghua University in Beijing to develop a skill development program for electronics assembly. The program will be ...
Read Full Story

SEHO and KIC Announce the Release of a New Value-Added Capability

News, Soldering Equipment - 11 Feb 2008
KIC announces that it has teamed with SEHO to co-develop communication software that integrates the process traceability and monitoring system with the reflow oven. The new communication software also...
Read Full Story

Indium Corporation Organizes Asian SMT Workshop Series

News, Soldering Equipment - 07 Jan 2008
Indium Corporation announces that its Vice President of Technology, Dr. Ning-Cheng Lee, will present workshops in Bangkok, Thailand; Penang, Malaysia; and Chennai, India, in January 2008. Indium Corpo...
Read Full Story

IPC and JEDEC to Host Technical Conference on Going Green

News, Soldering Equipment - 19 Nov 2007
Hot environmental topics affecting manufacturers in today’s marketplace include electronic waste and recycling, lead free, low halogen and energy use. IPC — Association Connecting Electronics Industri...
Read Full Story

Universal Instruments Reports Good Turnout for Joint Seminar in Shanghai

News, Soldering Equipment - 05 Nov 2007
Universal Instruments, together with six leading companies in electronics equipments and materials supply, recently held a seminar in Shanghai with a turnout of over 100 participants from leading manu...
Read Full Story
Previous   1    2    [3]    4    5    6    Next
 
SPONSORED LINKS
Sponsored Links
 
ADVERTISEMENT
 
 
| | | | | | |
Back to top
 
  © 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.