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Monday, October 13, 2008
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POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
SOLDERING EQUIPMENT   |   PAGE 3
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Reflow soldering system

Manufacturing Products & Equipment, Soldering Equipment - Mar 2008
MR933 • Employs an efficient and powerful forced convection heat transfer module design with precision profiling control • Lower machine set points—for minimal Delta-T across the board—and optimized ...
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IPC Signs Agreement with Tsinghua University for Vocational Training Program

News, Soldering Equipment - 25 Feb 2008
IPC — Association Connecting Electronics Industries announced a new initiative with Tsinghua University in Beijing to develop a skill development program for electronics assembly. The program will be ...
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SEHO and KIC Announce the Release of a New Value-Added Capability

News, Soldering Equipment - 11 Feb 2008
KIC announces that it has teamed with SEHO to co-develop communication software that integrates the process traceability and monitoring system with the reflow oven. The new communication software also...
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Indium Corporation Organizes Asian SMT Workshop Series

News, Soldering Equipment - 07 Jan 2008
Indium Corporation announces that its Vice President of Technology, Dr. Ning-Cheng Lee, will present workshops in Bangkok, Thailand; Penang, Malaysia; and Chennai, India, in January 2008. Indium Corpo...
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IPC and JEDEC to Host Technical Conference on Going Green

News, Soldering Equipment - 19 Nov 2007
Hot environmental topics affecting manufacturers in today’s marketplace include electronic waste and recycling, lead free, low halogen and energy use. IPC — Association Connecting Electronics Industri...
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Universal Instruments Reports Good Turnout for Joint Seminar in Shanghai

News, Soldering Equipment - 05 Nov 2007
Universal Instruments, together with six leading companies in electronics equipments and materials supply, recently held a seminar in Shanghai with a turnout of over 100 participants from leading manu...
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Solder recovery system

Manufacturing Products & Equipment, Soldering Equipment - Nov 2007
EVS 1000• Smaller, lighter version of the EVS 3000/6000 • Provide a capacity of 10lb/5kg of dross • Convert waste dross into pure solder in minutes • Provides a cleaner wave with less maintenance and...
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Lead-free solder paste

Manufacturing Products & Equipment, Soldering Equipment - Nov 2007
EM919G • 100 percent halide- and halogen free • Features ultra-low voiding characteristics, lighter flux residue color and shiny joints • Good solderability on all typical component and board finishes...
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Blakell Europlacer Adds Hexi Reflow Ovens to Its Portfolio

News, Soldering Equipment - 01 Nov 2007
Europlacer, a designer and manufacturer of SMT placement systems for the global electronics industry, announces the addition of Hexi Reflow Ovens to its product offering. According to the company, Hex...
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Blakell Europlacer Adds Hexi Reflow Ovens to Its Portfolio

Top News, Soldering Equipment - 01 Nov 2007
Europlacer, a designer and manufacturer of SMT placement systems for the global electronics industry, announces the addition of Hexi Reflow Ovens to its product offering. According to the company, Hex...
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