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| Manufacturing Products & Equipment, Soldering Equipment - Nov 2007 |
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| EVS 1000• Smaller, lighter version of the EVS 3000/6000 • Provide a capacity of 10lb/5kg of dross • Convert waste dross into pure solder in minutes • Provides a cleaner wave with less maintenance and... |
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| Manufacturing Products & Equipment, Soldering Equipment - Nov 2007 |
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| EM919G • 100 percent halide- and halogen free • Features ultra-low voiding characteristics, lighter flux residue color and shiny joints • Good solderability on all typical component and board finishes... |
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| News, Soldering Equipment - 01 Nov 2007 |
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| Europlacer, a designer and manufacturer of SMT placement systems for the global electronics industry, announces the addition of Hexi Reflow Ovens to its product offering. According to the company, Hex... |
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| Top News, Soldering Equipment - 01 Nov 2007 |
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| Europlacer, a designer and manufacturer of SMT placement systems for the global electronics industry, announces the addition of Hexi Reflow Ovens to its product offering. According to the company, Hex... |
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| News, Soldering Equipment - 25 Oct 2007 |
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| IPC and JEDEC announce they are holding an international lead-free conference, December 3–5, 2007 in Austin, Texas, USA to answers to the challenges of implementing lead-free processes as demand for i... |
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| News, Soldering Equipment - 22 Oct 2007 |
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| KIC announces that Marybeth (MB) Allen, General Manager of KIC International Sales Inc. — European Operations, will present during the upcoming Productronica exhibition and conference. During a forum ... |
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| Top News, Soldering Equipment - 22 Oct 2007 |
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| Universal Instruments, together with six leading companies in electronics equipments and materials supply, is going to hold a seminar on November 1 in Shanghai to share the latest technology and addre... |
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| Manufacturing Products & Equipment, Soldering Equipment - Oct 2007 |
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| Pyramax 100 Solder ReflowOven • 8-zone air or nitrogen models • 350ºC maximum temperature • Flexible platform configuration • Low nitrogen and power consumption• Provides precise control of heating/c... |
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| News, Soldering Equipment - 28 Sep 2007 |
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| Dedicated to surface mount, advanced packaging and related technologies, the 2007 SMTAI Conference and Exhibition, scheduled to take place October 7-11, 2007, in Orlando, FL, USA, will focus on lead-f... |
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| News, Soldering Equipment - 26 Sep 2007 |
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| The CBA Group, a group of companies comprised of Universal Instruments Corporation, Vitronics Soltec, Unovis Solutions, and Hover-Davis, announced that effective October 1 2007, Jean-Luc Pelissier, cu... |
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