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| Top News, Microelectronics/ Components - 30 Jan 2009 |
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| Following the collapse of the digital consumer market in the third quarter of 2008, Japanese chipmakers Toshiba, Sony and NEC have reported depressed results for Q4 and gloomy outlooks for 2009. By co... |
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| Market Trends, Microelectronics/ Components - 28 Jan 2009 |
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| This year, the world semiconductor market will fall by 28 percent in value and by 26 percent in unit shipments, according to Future Horizons at the company’s International Forecast Seminar 2009 (IFS20... |
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| News, Microelectronics/ Components - 23 Jan 2009 |
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| The Component Obsolescence Group (COG) has published best-practice guidance to help companies up and down the supply chain avoid counterfeit electronic components. "No-one is immune. Counterfeiting ac... |
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| Market Trends, Microelectronics/ Components - 23 Jan 2009 |
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| China’s semiconductor industry is expected to contract in 2009, the first time a significant decline has occurred since iSuppli Corp began gathering statistics on the market — and perhaps for the firs... |
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| News, Microelectronics/ Components - 23 Jan 2009 |
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| Intel Corporation disclosed plans to restructure some of its manufacturing operations and align its manufacturing capacity to current market conditions. The company will consolidate and streamline som... |
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| Environmental Compliance, Microelectronics/ Components - 22 Jan 2009 |
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| Most electronic components are now lead free. Yet even in a post-ROHS world, components that contain lead are in high demand. Industries such as defense, aerospace, and medical equipment are currently... |
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| News, Microelectronics/ Components - 22 Jan 2009 |
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| Ultra Clean Technology and FEI Company announced they have signed a Global Supplier Agreement under which Ultra Clean will provide hosted manufacturing services in the FEI Hillsboro, Oregon, USA facil... |
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| News, Microelectronics/ Components - 21 Jan 2009 |
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| Fujitsu Quality Laboratory Limited announced the establishment of a subsidiary in Suzhou which will offer local quality and environmental assurance services to companies in the electronics sector. Fuj... |
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| News, Microelectronics/ Components - 21 Jan 2009 |
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| Infineon Technologies AG has announced its third Generation of ultra-low-cost (ULC) mobile phone chips. The X-GOLD110 is said to be the world’s highest integrated one-chip solution for GSM/GPRS ultra ... |
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| Market Trends, Microelectronics/ Components - 15 Jan 2009 |
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| According to a newly released report from NanoMarkets, an industry analysis firm based here, organic electronics (OE) manufacturing has advanced to a stage where companies are now capable of producing... |
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