Login
  New Member Sign Up
Members
Log In Log In
Print Subscription Bookmark EMAsia
Click to navigate back to homepage
Wednesday, August 20, 2008
| | | | | | | | |
Go to EM Asia (China)
 
POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
MICROELECTRONICS/ COMPONENTS   |   PAGE 7
Sponsored Links

STMicroelectronics Announces its Automotive Navigation System-on-Chip Processor To Be Used in Range of Garmin Products

News, Microelectronics/ Components - 10 Mar 2008
STMicroelectronics announced that its Cartesio automotive-grade application processor System-on-Chip (SoC) with embedded GPS for navigation and telematics is to be implemented inside several products ...
Read Full Story

SMTA Announces “Best of Conference” Award for Pan Pacific 2008 Symposium

News, Microelectronics/ Components - 07 Mar 2008
SMTA announced that the Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that took place January 22-24, 2008 in Hawaii, USA was a great success. Speakers at the Pan Pacific Sympos...
Read Full Story

Celestica Collaborates with Microsoft on the Development of BEE3 Platform Prototypes

News, Microelectronics/ Components - 06 Mar 2008
Celestica Inc. announced it has collaborated with Microsoft on the design of the BEE3, Berkeley Emulation Engine 3rd version, to improve the ability of Microsoft and other companies to conduct compute...
Read Full Story

DEK to Exhibit at Semicon China 2008

News, Microelectronics/ Components - 03 Mar 2008
DEK announces that 2008 marks the 20th anniversary of Semicon China and 20 years of tremendous growth for China's semiconductor industry. Moreover, it is also the celebration of the company’s 40th ann...
Read Full Story

Intel Strategy Draws New Competitors

Market Trends, Microelectronics/ Components - 28 Feb 2008
Intel is now battling with new competitors in addition to known adversaries—AMD and IBM—making the next few years competitive for the silicon giant, reports In-Stat. Due to anticipated slower growth a...
Read Full Story

NanoMarkets Announces Upcoming Report on Silver Inks and Pastes for Printable Electronics

News, Microelectronics/ Components - 25 Feb 2008
NanoMarkets announces a new upcoming report that continues the firm’s coverage of the market opportunities arising from the use of silver powders and inks in printable electronics. The report will be ...
Read Full Story

NEC Confirms Feasibility of Environmentally Friendly Electronic Devices Using CNTs

Top News, Microelectronics/ Components - 14 Feb 2008
NEC Corporation announced the successful development of a carbon nanotube (CNT) transistor using a coating process. The basic operation of the new transistor with advanced characteristics has been ver...
Read Full Story

Arrow to Exhibit at Componex Nepcon India 2008

News, Microelectronics/ Components - 14 Feb 2008
Arrow Asia Pac Ltd., a business unit of Arrow Electronics Inc., announced it will be exhibiting its latest design solutions at Componex Nepcon India 2008, which will be held from 20 - 22 February 2008...
Read Full Story

SEMI Establishes Global Photovoltaic Initiative

News, Microelectronics/ Components - 12 Feb 2008
SEMI has announced details of the association’s global photovoltaic (PV) initiatives, including the formation of the SEMI PV Group to enhance member support in this critically important and high growt...
Read Full Story

STMicroelectronics Introduces "Market's Smallest" Single-Chip Camera Sensor for Mobile Applications

News, Microelectronics/ Components - 12 Feb 2008
STMicroelectronics has introduced what it says is the market’s smallest single-chip camera sensor for mobile applications. Coupling low space requirements with advanced image processing capabilities, ...
Read Full Story
Previous   1    2    3    4    5    6    [7]    8    Next
 
SPONSORED LINKS
Sponsored Links
 
ADVERTISEMENT
 
 
| | | | | | |
Back to top
 
  © 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.