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| News, Adhesives/Coatings - 30 Aug 2006 |
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| On September 25th, Pamela J. Gordon of Technology Forecasters Inc. and Harvey Stone of the Goodbye Chain Group will hold a half-day workshop, "Beyond RoHS and WEEE: Preparing for the Energy-using Prod... |
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| News, Adhesives/Coatings - 23 Aug 2006 |
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| Cogiscan Inc. recently got a new patent relating to "Automated manufacturing control system" by the US Patent Office. This global patent was originally filed in 2000 to protect the innovative aspects ... |
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| News, Adhesives/Coatings - 22 Aug 2006 |
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| Test and analysis lab Integrated Service Technology (IST) estimated around four to five listed Taiwanese electronics companies have been caught disqualified for RoHS (Restriction of Hazardous Substanc... |
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| Others, Adhesives/Coatings - 14 Aug 2006 |
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| Designed for new lead-free processes as well as tin-lead processes Minimum interference with pallets and leaves no rosin residue on wave soldering equipment Electrical reliability in both tin-lead an... |
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| Others, Adhesives/Coatings - 14 Aug 2006 |
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| Multi-functional material that is a drop-in replacement for waterwashable or no-clean tacky soldering fluxes (TSF) Intended for use with a thin-film applicator(rotating drum or slide) JEDEC Level 3, ... |
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| Top News, Adhesives/Coatings - 07 Aug 2006 |
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| GlobalTRONICS 2006, said to be Asia’s most established electronics manufacturing tradeshow, is set to be a vital event for the region’s electronics manufacturing industry. The recent 1 July introducti... |
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| Others, Adhesives/Coatings - 01 Aug 2006 |
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| F AquaSonic AQP • Removes solder paste and flux from stencils, printed circuit boards, tools, and other surfaces quickly, effectively, and safely • Non- hazardous, non-flammable, virtually odor free,... |
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| Others, Adhesives/Coatings - 01 Aug 2006 |
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| F Uni-form • M5-82 linear epoxy systems remains flexible under temperature changes • Improves adhesion to component materials with dissimilar coefficients of thermal expansion • Developed for under-t... |
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| Others, Adhesives/Coatings - 01 Aug 2006 |
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| F Loctite 3549 • Designed to quickly fill the space beneath the CSP and BGA packages • Cures rapidly at low temperature • Minimizes thermal stress to other components on the printed circuit board (PCB... |
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| Others, Adhesives/Coatings - 01 Aug 2006 |
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| F Simple Green • High level of user and environmental safety • Designed for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners • Available in a trigger spray for manual ste... |
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