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| News, Adhesives/Coatings - 10 May 2006 |
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| Sanmina-SCI Corporation announce that it has entered into a joint development agreement with Shocking Technologies Inc. to develop the use of Shocking’s specialty polymers for embedding ESD (Electrost... |
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| News, Adhesives/Coatings - 13 Apr 2006 |
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| Indium Corporation announced the addition of Damian Santhanasamy as Technical Engineer at Indium Corporation’s Asia-Pacific Operations. He will be stationed in Johor, Malaysia and will report to Chia ... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| SM-700 • Belt widths range from 6 to 30”, and lengths as small as 5 feet and as long as 40 feet • Variable speed DC drive motor and 1” tall side rails (removable) • Also available in a lift gate (pass... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| S63-OA • Solder paste is stable, offering extended shelf and stencil life, and delivering results under thermal load in a lead-free reflow soldering process • Available in most common alloys, includi... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| Natrasorb 900 • Sorbent technology prevents water damage to moisture-sensitive electronics • Eliminates condensation caused by temperature fluctuations during shipping and humid operating environment... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| WaveMax 5000 • Thermoset composite material for durable, high-temperature solder pallets • Provides mechanical strength at a continuous operating temperature of 260°C • Withstands exposures to temper... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| WF-9942 • No-Residue and No-Clean • Works in both mixed-technology and through-hole applications • Can be used with both lead-free and SnPb solder alloys • Wide process window offers good solderabili... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| EM907 • For higher melting temperature lead-free alloys, such as the family of SnAgCu (SAC) alloys • Offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste • Capable of ... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| K100 • Near-eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint • Offers bright, smooth solder joints with no visible shrinkage effects, ... |
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| Others, Adhesives/Coatings - 01 Mar 2006 |
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| BlissLift • Fast swap rechargeable batteries • Ergonomic design that creates consistency of movement and performance throughout the factory • Include an offline battery charger, a second battery, int... |
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