Login
  New Member Sign Up
Members
Log In Log In
Print Subscription Bookmark EMAsia
Click to navigate back to homepage
Friday, November 21, 2008
| | | | | | | | |
Go to EM Asia (China)
 
POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
ADHESIVES/COATINGS   |   PAGE 15
Sponsored Links

Halide-free, VOC-free wave solder flux

Others, Adhesives/Coatings - 05 Jul 2005
1072 VOC-Free Combines the benefits of rosin with the environmentally friendliness of a water-based product Developed for wave soldering of surface-mount, mixed-technology and through-hole electronic ...
Read Full Story

Material Control

Features, Adhesives/Coatings - Jul 2005
Cost pressures are driving companies to grow leaner, ansd this includes the elimination of errors in material tracking. While requiring traceability, OEMs are emphasizing data integrity. They understa...
Read Full Story

Improved adhesion, faster curing

Others, Adhesives/Coatings - 09 May 2005
Hysol 3323/3327/3329 UV-cure encapsulants for use in smart card IC module manufacturing Pass mechanical stress testing and high-reliability tests, typically –55° to +125°C temperature cycling and heat...
Read Full Story

Seamless desiccant insertion into electronic housings

Others, Adhesives/Coatings - 07 Jan 2005
SLF DesiMax SLF Sorbent Tape protect sensitive electronic components from moisture Absorb trace amounts of moisture over long periods of time Dust-free Bends to accommodate curves and corners Safegua...
Read Full Story

Humidity resistant solder paste

Others, Adhesives/Coatings - 07 Jan 2005
Multicore MP218 Halide-free, no-clean formulation Pin-testable and offers broad process windows for both printing and reflow High resistance to humidity gives consistent performance within assembly e...
Read Full Story

No-clean lead-free solderpaste

Others, Adhesives/Coatings - 08 Nov 2004
EM907 Capable of extended downtimes in printing Maintains print quality at high print speeds up to 6 in/sec (150mm/sec) Prevent bridges and solder ball formation Solderability to a wide variety of boa...
Read Full Story

Non-intrusive pin-and socket interconnect system

Others, Adhesives/Coatings - 08 Nov 2004
Pin-and-Socket Eliminates need for specialized handling or equipment Both pin and socket components are packaged in standard EIA tape-and-reel formats for direct pick-up and placement Adapt with exist...
Read Full Story

Reel-to-Reel RFID tag assembly system

Others, Adhesives/Coatings - 08 Nov 2004
RFID Full 20" wide web process capability 12-micron placement repeatability +/- 3 sigma (process dependent) Passive or active designs Direct die pick from wafer down to .008" Capable of tape and reel ...
Read Full Story

High throughput underfill solution

Others, Adhesives/Coatings - 08 Nov 2004
Camalot XyflexPro HVB Conveyorless material handling system and dual dispense heads Three-to-five times faster than conventional single lane systems Maximum dispense head utilization without requiring...
Read Full Story

PC motherboard industry: In grips of change

Cover Story, Adhesives/Coatings - Nov 2004
Back in 2002, the PC motherboard industry was just entering a period of major restructuring as manufacturers struggled to reduce costs to maintain their competitiveness in a challenging business envir...
Read Full Story
Previous   9    10    11    12    13    14    [15]    16    Next
 
SPONSORED LINKS
Sponsored Links
 
ADVERTISEMENT
 
 
| | | | | | |
Back to top
 
  © 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.