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Friday, November 21, 2008
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POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
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ADHESIVES/COATINGS   |   PAGE 16
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Flux for reflow soldering

Others, Adhesives/Coatings - 13 Sep 2004
...
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High-strength polymer for electronics

Others, Adhesives/Coatings - 13 Sep 2004
PEEK polymer Mechanical properties retained at high melting temperature Easy to process; resistant to wear, friction and chemicals Low smoke emission; low levels of outgassing and ionic extractables M...
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Lead-free solder for fine-pitch printing

Others, Adhesives/Coatings - 13 Sep 2004
R905 No-clean solder paste Printing capability 20mils; printing speed 150mm/s Compatible with variety of metallizations Targeted at CSP and 0201 applications Kester Fax 65-6242-9036 www.kester.com.sg ...
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Nd-Fe-B alloy for motor applications

Others, Adhesives/Coatings - 13 Sep 2004
...
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Low-cost flip-chip capability

Others, Adhesives/Coatings - 13 Sep 2004
AdVantis AFC-42 Offers speed, flexibility and cost-per-placement efficiency Uses single-beam positioning system Includes high-end assembly functionalities such as high magnification cameras, flip-chip...
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Efficient cleaning for electronic circuit assemblies

Others, Adhesives/Coatings - 13 Sep 2004
ACCEL MicroCel Centrifugal cleaning system for solubilization and contaminant removal Handles most cleaning solvents and leaves no visible residue Eliminates re-deposits of contaminants on cleaned sur...
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Flux for surface mount device PCBs

Others, Adhesives/Coatings - 12 Jul 2004
AGF-200J-12 RA type fluxes based on rosin with activator Specific gravity of 0.822 (at 20ˇC); spreading factor of 90% Improves solderability for plated through-holes Targeted at soldering of surface m...
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PCB spacers for complex circuits

Others, Adhesives/Coatings - 12 Jul 2004
Bumpon 6700 series High performance, synthetic rubber R25 adhesive Adheres to variety of surfaces such as plastics, FR4 and various metal surfaces Keeps sensitive components free of damaging heat buil...
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Dispense-control technology in compact package

Others, Adhesives/Coatings - 12 Jul 2004
DispenseMate D550 Small footprint; flexible and scalable Benchtop format; targeted at batch processing or prototyping Recommended for solder pastes, surface mount adhesives and bonding Optional featur...
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