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| News, Packaging & Interconnect - 16 Oct 2008 |
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| KIC announces that MB (Marybeth) Allen will present a paper at the European and International Electronics Assembly Reliability Summit in Tallinn, Estonia from October 22-24, 2008. The paper focuses on... |
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| News, Packaging & Interconnect - 06 Oct 2008 |
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| Endicott Interconnect Technologies Inc (EI) announced a senior management appointment as part of the strategy to drive operational effectiveness. Jennifer de Souza has been promoted to the position of... |
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| News, Packaging & Interconnect - 18 Sep 2008 |
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| Tyco Electronics Ltd announced that the company has appointed Rob Shaddock to the newly created role of Senior Vice President and Chief Technology Officer (CTO), effective September 15. He will report... |
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| News, Packaging & Interconnect - 01 Aug 2008 |
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| Kulicke & Soffa Industries Inc (K&S) has announced that the company has entered into definitive agreements to acquire substantially all of the assets of Orthodyne Electronics Corporation, a supplier o... |
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| News, Packaging & Interconnect - 24 Jul 2008 |
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| BTU International Inc, a supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announced that it received in the past week two awards at t... |
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| News, Packaging & Interconnect - 23 Jul 2008 |
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| DEK announces that its latest advance stencil technology, VectorGuard Platinum, was introduced last week at Semicon West and earned an Advanced Packaging Award. According to the company, VectorGuard P... |
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| News, Packaging & Interconnect - 17 Jul 2008 |
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| Vertical Circuits Inc (VCI), a supplier of advanced 3D die-level interconnect solutions, announced its recognition of Asymtek, a Nordson company and provider of dispensing, coating and jetting technol... |
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| News, Packaging & Interconnect - 16 Jul 2008 |
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| Tanaka Denshi Kogyo KK (Tokyo), a manufacturer of bonding wires, announced that it will substantially expand the production of copper bonding wires with good electrical conductivity and mechanical pro... |
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| News, Packaging & Interconnect - 14 Jul 2008 |
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| Molex Incorporated announced that it has developed a new surface mount technology (SMT) attach method that features greater fatigue strength and lower applied costs compared to traditional SMT mountin... |
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| News, Packaging & Interconnect - 01 Jul 2008 |
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| Mentor Graphics Corporation announced the publication of a new book written by Charles Pfeil, Engineering Director of Mentor’s Systems Design Division, entitled BGA Breakouts and Routing, Effective De... |
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