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| Henkel announced that it has worked with STMicroelectronics to validate the performance of Henkel's Ablestik C100 conductive die attach film materials. The materials were utilized in the production of... |
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| News, Packaging & Interconnect - 14 Jul 2011 |
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| OMRON Corporation announced that the company has launched mass production of a connector using subminiature contacts electroformed through an electroplating process, said to be the first of its kind i... |
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| News, Packaging & Interconnect - 13 Jul 2011 |
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| 3M Co recently added several new equipment in a semiconductor application laboratory it is operating in Yangmei City, Taiwan. In the laboratory`s clean room the company has recently installed wafer su... |
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| News, Packaging & Interconnect - 12 Jul 2011 |
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| Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including... |
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| News, Packaging & Interconnect - 01 Jun 2011 |
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| IPC has released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issu... |
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| News, Packaging & Interconnect - 02 May 2011 |
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| Engineered Conductive Materials LLC will showcase its conductive stringer attach adhesives at the upcoming 4th International Power Generation Expo. The event is scheduled to take place March 2-4, 2011... |
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| News, Packaging & Interconnect - 17 Feb 2011 |
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| The World Gold Council (WGC) has published a special issue of Gold Bulletin devoted to the use of gold in electronics. This edition covers current technological uses of the metal such as in gold bondi... |
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| News, Packaging & Interconnect - 19 Oct 2010 |
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| ATE China 2010, the international event that focuses on industrial assembly machines and technologies in China, will open at Shenzhen Exhibition Center on August 31, 2010. It will exhibit state-of-the... |
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| Top News, Packaging & Interconnect - 27 Aug 2010 |
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| Electronic components distributor Digi-Key Corporation and Harwin announced the two companies have entered into an agreement in which Digi-Key will distribute Harwin's products to customers worldwide.... |
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| News, Packaging & Interconnect - 23 Aug 2010 |
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| Package-on-package (PoP) component applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. A new... |
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| News, Packaging & Interconnect - 19 Aug 2010 |
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