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| Top News, Packaging & Interconnect - 27 Aug 2010 |
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| ATE China 2010, the international event that focuses on industrial assembly machines and technologies in China, will open at Shenzhen Exhibition Center on August 31, 2010. It will exhibit state-of-the... |
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| News, Packaging & Interconnect - 23 Aug 2010 |
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| Electronic components distributor Digi-Key Corporation and Harwin announced the two companies have entered into an agreement in which Digi-Key will distribute Harwin's products to customers worldwide.... |
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| News, Packaging & Interconnect - 19 Aug 2010 |
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| Package-on-package (PoP) component applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. A new... |
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| News, Packaging & Interconnect - 23 Jul 2010 |
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| Electronic components distributor Digi-Key Corporation announced it has signed an expanded distribution agreement with Panasonic Electric Works Corporation of America. The expanded agreement will allo... |
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| News, Packaging & Interconnect - 23 Apr 2010 |
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| IPC—Association Connecting Electronics Industries has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more ... |
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| News, Packaging & Interconnect - 22 Apr 2010 |
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| Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics announced that they have formed a consortium to jointly investigate a... |
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| News, Packaging & Interconnect - 16 Apr 2010 |
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| The International Electronics Manufacturing Initiative (iNEMI) is organizing four new initiatives to address gaps in organic substrate technologies. These initiatives will focus on warpage (understand... |
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| News, Packaging & Interconnect - 06 Apr 2010 |
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| IPC—Association Connecting Electronics Industries has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC said its most widely-used standard, which provides visual accept... |
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| News, Packaging & Interconnect - 03 Apr 2010 |
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| Practical Components and Aim Solder announce they have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacture... |
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| News, Packaging & Interconnect - 30 Mar 2010 |
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| Numerous companies in the electronics assembly and printed board industries will be making presentations at APEX 2010, scheduled to take place April 6-8, 2010 in Las Vegas, USA. They include: PCB Matr... |
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