Login
  New Member Sign Up
Members
Log In Log In
Print Subscription Bookmark EMAsia
Click to navigate back to homepage
Wednesday, May 23, 2012
| | | | | | | | |
Go to EM Asia (China)
 
ema-cover
 
 
 
 
 
 
PACKAGING & INTERCONNECT   |   PAGE 2


Digi-Key and Panasonic Electric Works Expand Distribution Agreement to Asia Pacific

Electronic components distributor Digi-Key Corporation announced it has signed an expanded distribution agreement with Panasonic Electric Works Corporation of America. The expanded agreement will allo...
News, Packaging & Interconnect - 23 Jul 2010

New Revision of IPC-4202 Gives Updated Guidance in Flexible Base Dielectric Materials

IPC—Association Connecting Electronics Industries has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more ...
News, Packaging & Interconnect - 23 Apr 2010

Semiconductor Industry Leaders Form DA5 Consortium to Explore Lead Free Solutions

Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics announced that they have formed a consortium to jointly investigate a...
News, Packaging & Interconnect - 22 Apr 2010

iNEMI Organizes Four New Packaging Initiatives

The International Electronics Manufacturing Initiative (iNEMI) is organizing four new initiatives to address gaps in organic substrate technologies. These initiatives will focus on warpage (understand...
News, Packaging & Interconnect - 16 Apr 2010

IPC-A-610E Released: Industry Requirements for Acceptability of Electronic Assemblies Updated

IPC—Association Connecting Electronics Industries has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC said its most widely-used standard, which provides visual accept...
News, Packaging & Interconnect - 06 Apr 2010

Practical Components and Aim Solder Offer Updated Solutions to Printing Challenges

Practical Components and Aim Solder announce they have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacture...
News, Packaging & Interconnect - 03 Apr 2010

Leading Companies to Present at APEX 2010

Numerous companies in the electronics assembly and printed board industries will be making presentations at APEX 2010, scheduled to take place April 6-8, 2010 in Las Vegas, USA. They include: PCB Matr...
News, Packaging & Interconnect - 30 Mar 2010

ESI Expands its Singapore-Based Operations

Electro Scientific Industries Inc announced it has expanded its Singapore operations and has opened a new Asia manufacturing and service plant in the Kaki Bukit industrial hub. ESI will initially use ...
News, Packaging & Interconnect - 15 Mar 2010

Graphic Plc Celebrates 42 Years in Business with AS9100 Approval

Graphic Plc announces the company is currently celebrating 42 years in the business with the AS9100 approval. According to the company, this approval demonstrates Graphic’s commitment to meeting the h...
News, Packaging & Interconnect - 11 Mar 2010

Weiner International Associates Appoints Industry Expert as Senior Associate

Weiner International Associates announces the appointment of John T (Jack) Fisher, said to be America’s leading electronic interconnect Technology Roadmap expert, as a Senior Associate. According to t...
News, Packaging & Interconnect - 09 Feb 2010
Previous   1    [2]    3    4    5    6    7    8    Next
 
 
ADVERTISEMENT
 
| | | | | | |
Back to top
 
  © 2012 Ten Alps Communications Asia. All rights reserved.
Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.