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| News, Packaging & Interconnect - 26 Jun 2008 |
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| DuPont Electronic Technologies has announced a global price increase of up to 20 percent, effective June 16, 2008. The company cites rising raw material, transportation and energy costs among its reas... |
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| News, Packaging & Interconnect - 18 Jun 2008 |
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| At the conclusion of the 58th Electronic Components and Technology Conference (ECTC) held at Disney's Contemporary Hotel, Lake Buena Vista, FL, USA from May 27- May 30, 2008, the show organizers repor... |
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| News, Packaging & Interconnect - 05 May 2008 |
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| The SMTA announces that the program for their 21st annual conference, SMTA International, is finalized and available on-line at www.smta.org/smtai. The conference will be held at Disney's Coronado Spr... |
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| News, Packaging & Interconnect - 05 May 2008 |
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| IPC and the Jisso International Council (JIC) are sponsoring a technical seminar, Implementing Advanced Interconnect Technology Solutions, May 21–22, 2008, in Atlanta, USA. Hosted by Georgia Institute... |
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| News, Packaging & Interconnect - 21 Apr 2008 |
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| An Evolving Technologies Summit is scheduled during the SMTA’s annual conference, SMTA International, at the Disney's Coronado Springs Resort and Convention Center, Orlando, FL, USA from August 17-21,... |
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| News, Packaging & Interconnect - 21 Apr 2008 |
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| IPC — Association Connecting Electronics Industries has announced the release of IPC-7095B, Design and Assembly Process Implementation for BGAs. Implementing ball grid array (BGA) and fine-pitch ball ... |
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| News, Packaging & Interconnect - 16 Apr 2008 |
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| IPC — Association Connecting Electronics Industries will bring electronics industry leaders together to discuss and assess key enabling technologies and industry dynamics that are driving advanced pac... |
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| News, Packaging & Interconnect - 08 Apr 2008 |
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| Sanmina-SCI Corporation has announced SuperBC--a new patent pending technology for Buried Capacitance applications in providing bypass capacitance inside silicon chip packages and high-performance PCB... |
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| News, Packaging & Interconnect - 28 Mar 2008 |
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| Universal Instruments announced that it is going to hold a seminar and a practical workshop on system-in-package technologies in April in its Advanced Process Laboratory in Shanghai to share its lates... |
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| Top News, Packaging & Interconnect - 18 Mar 2008 |
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| ECWC11, a global convention sponsored by World Electronic Circuits Council (WECC) held every three years, kicked off in Shanghai on March 17 at the Everbright Convention and Exhibition International H... |
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