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| News, Packaging & Interconnect - 17 Mar 2008 |
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| Universal Instruments announces that it will demonstrate the state-of-the-art surface mounting technologies, including system-in-package (SiP) applications, odd-form components solutions and high spee... |
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| News, Packaging & Interconnect - 11 Mar 2008 |
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| IPC—Association Connecting Electronics Industries announced the 12 products that will be featured in the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo, APEX and the Designer... |
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| News, Packaging & Interconnect - 04 Mar 2008 |
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| Universal Instruments announces that it will showcase its latest technology on the convergence of SMT and semiconductor packaging technology during Nepcon China to be held from April 8 to 11 at the Ev... |
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| News, Packaging & Interconnect - 25 Feb 2008 |
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| IPC — Association Connecting Electronics Industries and the Jisso International Council (JIC) announce that they are sponsoring a technical seminar, May 21–22, 2008, to provide information on the late... |
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| News, Packaging & Interconnect - 04 Feb 2008 |
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| IPC — Association Connecting Electronics Industries has announced the release of Geographic Strategies for Global Expansion in the Electronic Interconnect Industry: Where to Invest for Long-Term Busin... |
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| News, Packaging & Interconnect - 03 Jan 2008 |
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| Avnet Inc. announced that it has acquired YEL Electronics Hong Kong Ltd. (YEL). YEL, which was established in 1992, is a distributor of interconnect, passive, electromechanical and limited semiconduct... |
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| Top News, Packaging & Interconnect - 03 Jan 2008 |
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| Avnet Inc. announced that it has acquired YEL Electronics Hong Kong Ltd. (YEL). YEL, which was established in 1992, is a distributor of interconnect, passive, electromechanical and limited semiconduct... |
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| News, Packaging & Interconnect - 26 Dec 2007 |
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| IME researchers presented 18 papers covering topics in advanced packaging, optoelectronics, microfluidics and TSV 3D silicon technology at the Electronics Packaging Technology Conference (EPTC) 2007. ... |
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| News, Packaging & Interconnect - 17 Dec 2007 |
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| FCI, a manufacturer of connectors and interconnect systems, announced that it has been recognized as one of China’s Electronics Component Leaders in the category of Excellent Service Provider. The awa... |
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| Market Trends, Packaging & Interconnect - 29 Nov 2007 |
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| The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 billion in 2007 and grow to $20.2 billion by 2011, according to a new study by SEMI ... |
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