|
|
|
|
|
|
|
| News, Packaging & Interconnect - 25 Feb 2008 |
|
| IPC — Association Connecting Electronics Industries and the Jisso International Council (JIC) announce that they are sponsoring a technical seminar, May 21–22, 2008, to provide information on the late... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 04 Feb 2008 |
|
| IPC — Association Connecting Electronics Industries has announced the release of Geographic Strategies for Global Expansion in the Electronic Interconnect Industry: Where to Invest for Long-Term Busin... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 03 Jan 2008 |
|
| Avnet Inc. announced that it has acquired YEL Electronics Hong Kong Ltd. (YEL). YEL, which was established in 1992, is a distributor of interconnect, passive, electromechanical and limited semiconduct... |
|
| Read Full Story |
|
|
|
|
|
|
| Top News, Packaging & Interconnect - 03 Jan 2008 |
|
| Avnet Inc. announced that it has acquired YEL Electronics Hong Kong Ltd. (YEL). YEL, which was established in 1992, is a distributor of interconnect, passive, electromechanical and limited semiconduct... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 26 Dec 2007 |
|
| IME researchers presented 18 papers covering topics in advanced packaging, optoelectronics, microfluidics and TSV 3D silicon technology at the Electronics Packaging Technology Conference (EPTC) 2007. ... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 17 Dec 2007 |
|
| FCI, a manufacturer of connectors and interconnect systems, announced that it has been recognized as one of China’s Electronics Component Leaders in the category of Excellent Service Provider. The awa... |
|
| Read Full Story |
|
|
|
|
|
|
| Market Trends, Packaging & Interconnect - 29 Nov 2007 |
|
| The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 billion in 2007 and grow to $20.2 billion by 2011, according to a new study by SEMI ... |
|
| Read Full Story |
|
|
|
|
|
|
| Top News, Packaging & Interconnect - 20 Nov 2007 |
|
| In the packaging sector of the semiconductor industry, the most significant current trend is device embedding and stacking. Devices today are being stacked in ways that would have been inconceivable j... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 12 Nov 2007 |
|
| Aspocomp has signed an agreement according to which it will contribute its shareholdings in its subsidiaries in China and India as well as certain equipment from its Salo plant to a new holding compan... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 05 Nov 2007 |
|
| Universal Instruments, together with six leading companies in electronics equipments and materials supply, recently held a seminar in Shanghai with a turnout of over 100 participants from leading manu... |
|
| Read Full Story |
|
|
