|
|
|
|
|
|
|
| Top News, Packaging & Interconnect - 20 Nov 2007 |
|
| In the packaging sector of the semiconductor industry, the most significant current trend is device embedding and stacking. Devices today are being stacked in ways that would have been inconceivable j... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 12 Nov 2007 |
|
| Aspocomp has signed an agreement according to which it will contribute its shareholdings in its subsidiaries in China and India as well as certain equipment from its Salo plant to a new holding compan... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 05 Nov 2007 |
|
| Universal Instruments, together with six leading companies in electronics equipments and materials supply, recently held a seminar in Shanghai with a turnout of over 100 participants from leading manu... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 25 Oct 2007 |
|
| Endicott Interconnect (EI) Technologies says its System in Package (SiP) designs reduce size and weight, sweep multiple packages from a printed wiring board (PWB) into a SiP for improved electrical pe... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 25 Oct 2007 |
|
| IPC and JEDEC announce they are holding an international lead-free conference, December 3–5, 2007 in Austin, Texas, USA to answers to the challenges of implementing lead-free processes as demand for i... |
|
| Read Full Story |
|
|
|
|
|
|
| Market Trends, Packaging & Interconnect - 23 Oct 2007 |
|
| A new report from NanoMarkets LC, a market research firm based here says that silicon nanocrystals and printed forms of silicon will transform electronics over the next decade with new memory, logic, ... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 22 Oct 2007 |
|
| Henkel Huawei Electronics Co. Ltd., a joint venture of Huawei Electronics and Henkel Corporation, has announced plans to unveil its new state-of-the-art mold compound manufacturing facility in Lianyun... |
|
| Read Full Story |
|
|
|
|
|
|
| Top News, Packaging & Interconnect - 22 Oct 2007 |
|
| Universal Instruments, together with six leading companies in electronics equipments and materials supply, is going to hold a seminar on November 1 in Shanghai to share the latest technology and addre... |
|
| Read Full Story |
|
|
|
|
|
|
| Top News, Packaging & Interconnect - 19 Oct 2007 |
|
| Henkel Huawei Electronics Co. Ltd., a joint venture of Huawei Electronics and Henkel Corporation, has announced plans to unveil its new state-of-the-art mold compound manufacturing facility in Lianyun... |
|
| Read Full Story |
|
|
|
|
|
|
| Top News, Packaging & Interconnect - 04 Oct 2007 |
|
| Verdant Electronics say that bringing together likeminded individuals to cooperatively shape a better future for electronics manufacturing is the fundamental purpose of the first Occam Process Confere... |
|
| Read Full Story |
|
|
