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| News, Packaging & Interconnect - 12 Nov 2007 |
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| Aspocomp has signed an agreement according to which it will contribute its shareholdings in its subsidiaries in China and India as well as certain equipment from its Salo plant to a new holding compan... |
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| News, Packaging & Interconnect - 05 Nov 2007 |
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| Universal Instruments, together with six leading companies in electronics equipments and materials supply, recently held a seminar in Shanghai with a turnout of over 100 participants from leading manu... |
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| News, Packaging & Interconnect - 25 Oct 2007 |
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| Endicott Interconnect (EI) Technologies says its System in Package (SiP) designs reduce size and weight, sweep multiple packages from a printed wiring board (PWB) into a SiP for improved electrical pe... |
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| News, Packaging & Interconnect - 25 Oct 2007 |
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| IPC and JEDEC announce they are holding an international lead-free conference, December 3–5, 2007 in Austin, Texas, USA to answers to the challenges of implementing lead-free processes as demand for i... |
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| Market Trends, Packaging & Interconnect - 23 Oct 2007 |
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| A new report from NanoMarkets LC, a market research firm based here says that silicon nanocrystals and printed forms of silicon will transform electronics over the next decade with new memory, logic, ... |
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| News, Packaging & Interconnect - 22 Oct 2007 |
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| Henkel Huawei Electronics Co. Ltd., a joint venture of Huawei Electronics and Henkel Corporation, has announced plans to unveil its new state-of-the-art mold compound manufacturing facility in Lianyun... |
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| Top News, Packaging & Interconnect - 22 Oct 2007 |
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| Universal Instruments, together with six leading companies in electronics equipments and materials supply, is going to hold a seminar on November 1 in Shanghai to share the latest technology and addre... |
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| Top News, Packaging & Interconnect - 19 Oct 2007 |
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| Henkel Huawei Electronics Co. Ltd., a joint venture of Huawei Electronics and Henkel Corporation, has announced plans to unveil its new state-of-the-art mold compound manufacturing facility in Lianyun... |
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| Top News, Packaging & Interconnect - 04 Oct 2007 |
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| Verdant Electronics say that bringing together likeminded individuals to cooperatively shape a better future for electronics manufacturing is the fundamental purpose of the first Occam Process Confere... |
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| Manufacturing Products & Equipment, Packaging & Interconnect - Oct 2007 |
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| Hysol QMI5100 and QMI5200 • Designed to streamline the die attach process, particularly for stacked die applications • Formulations combine the properties and functions of die attach film and dicing t... |
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