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| Manufacturing Products & Equipment, Packaging & Interconnect - Oct 2007 |
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| Hysol QMI5100 and QMI5200 • Designed to streamline the die attach process, particularly for stacked die applications • Formulations combine the properties and functions of die attach film and dicing t... |
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| News, Packaging & Interconnect - 29 Aug 2007 |
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| For the 8th time in a row SUSS MicroTec, a global supplier of semiconductor processing equipment is organizing its annual tour of Asia to highlight recent developments in MEMS, Advanced Packaging and ... |
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| News, Packaging & Interconnect - 27 Aug 2007 |
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| Verdant Electronics’ founder and Occam Process developer Joseph (Joe) Fjelstad will present the technology, address frequently asked questions and answer live questions from webinar participants on Se... |
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| News, Packaging & Interconnect - 21 Aug 2007 |
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| Goepel electronic introduces a new generation of intelligent tools for the structural test of complex memory clusters as another feature of the boundary scan software platform System Cascon. According... |
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| News, Packaging & Interconnect - 20 Aug 2007 |
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| IPC — Association Connecting Electronics Industries has announced that its Executive Market Forum has commissioned two leading industry research firms to conduct in-depth market studies on strategies ... |
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| News, Packaging & Interconnect - 02 Aug 2007 |
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| Verdant Electronics announced that it conceived and is developing an “evolutionary” new technology for both Printed Circuit Boards (PCBs) and Printed Circuit Board Assemblies (PCBAs) which promises to... |
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| Top News, Packaging & Interconnect - 02 Aug 2007 |
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| Verdant Electronics announced that it conceived and is developing an “evolutionary” new technology for both Printed Circuit Boards (PCBs) and Printed Circuit Board Assemblies (PCBAs) which promises to... |
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| News, Packaging & Interconnect - 25 Jul 2007 |
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| DEK announces that it was the recipient of two acclaimed industry awards at Semicon West held recently in San Francisco, California, USA. The company was honored with an Editors’ Choice Award from Sem... |
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| Top News, Packaging & Interconnect - 24 Jul 2007 |
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| Following through on plans the company first announced in 2004, IBM Corp. announced that it has begun production on its totally lead-free "controlled collapse chip connection new process" (C4NP) semic... |
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| News, Packaging & Interconnect - 23 Jul 2007 |
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| Universal Instruments announced it is going to hold a free seminar on flip chip packaging assembly in August to customers and interested parties in its Advanced Process Laboratory in Shanghai. The sem... |
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