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| Manufacturing Products & Equipment, Packaging & Interconnect - Jul 2007 |
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| Multi-chip die bonding: 2200 evo •Dispenser and bonding system work in parallel in a single module for throughput up to 7,000 cph • Highly flexible with a footprint of 116x122cm • Proc... |
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| News, Packaging & Interconnect - 20 May 2007 |
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| SMTA China invites industry members to participate in the SMTA China South Conference, which will be held 27-31 August 2007. The conference will be held in conjunction with Nepcon South China and will... |
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| Top News, Packaging & Interconnect - 15 May 2007 |
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| After eight years of closed meetings, the Jisso International Council announces it is holding its first international forum in Singapore on Wednesday, 6 June, at the Singapore Institute of Manufacturi... |
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| Top News, Packaging & Interconnect - 08 Apr 2007 |
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| IPC — Association Connecting Electronics Industries has announced the release of the “2006–2007 IPC International Technology Roadmap for Electronic Interconnections.” Published every two years, the IP... |
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| Manufacturing Products & Equipment, Packaging & Interconnect - Jan 2007 |
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| Others, Packaging & Interconnect - 01 Jan 2007 |
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| HB16/HB05 • Capable of wedge and ball bonding in one machine, simply by changing the bond tool and selecting the appropriate mode via software • Bench-top systems are suitable for small production, pr... |
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| News, Packaging & Interconnect - 04 Dec 2006 |
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| The Board of Directors of Rohm and Haas Company elected David N. Schram as Vice President of Rohm and Haas Company. David N. Schram joined LeaRonal in 1973 and held various positions including researc... |
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| News, Packaging & Interconnect - 20 Nov 2006 |
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| Finetech has formed a new technical partnership with Technical Product Trade (TPT) located in Wessling, Germany to offer manual and semiautomatic wire bonders in the North American market. The bonders... |
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| News, Packaging & Interconnect - 13 Nov 2006 |
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| Outsourced packaging becomes the mainstream as prices of semiconductors are fluctuating because of the continual advent of new products and the shortened lifecycle. In view of the cost of a complete s... |
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| News, Packaging & Interconnect - 18 Jul 2006 |
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| DEK again took to the podium at Semicon West event to accept not one, but two Advanced Packaging Awards in recognition of the company’s latest technology innovations. Accepting the awards on behalf of... |
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