|
|
|
|
|
|
|
| News, Packaging & Interconnect - 07 Jun 2006 |
|
| ERNI, manufacturer and worldwide supplier of a broad line of interconnects for the telecommunications, data communications, computer, industrial and medical markets has opened a third office in Beijin... |
|
| Read Full Story |
|
|
|
|
|
|
| Environmental Compliance, Packaging & Interconnect - 16 May 2006 |
|
| Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. The results of these studies have been reported rather sporadical... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 27 Feb 2006 |
|
| Chipworks announced that they have uncovered the first widespread adoption in microprocessors of Copper Pillar Bumping (CPB) technology used to connect the die to the printed wiring board in Intel’s 6... |
|
| Read Full Story |
|
|
|
|
|
|
| News, Packaging & Interconnect - 06 Feb 2006 |
|
| Practical Components announces that it has introduced Amkor Technology’s package on package (PoP) family of mating bottom and top daisy chain components to its line of dummy components. Package on Pac... |
|
| Read Full Story |
|
|
|
|
|
|
| Cover Story, Packaging & Interconnect - Mar 2005 |
|
| For electronics manufacturers deciding to invest in new SMD placement machines, cost of production (CoP), operational flexibility and technology capabilities are important drivers to take into accoun... |
|
| Read Full Story |
|
|
|
|
|
|
| Others, Packaging & Interconnect - 07 Jan 2005 |
|
| Fully automatic fluid dispensing M-620 Fluidmove for Windows NT software controls all machine parameters and events to achieve high-level system performance with auser-friendly interface Integrated pa... |
|
| Read Full Story |
|
|
|
|
|
|
| Others, Packaging & Interconnect - 08 Nov 2004 |
|
| Pin-and-Socket Eliminates need for specialized handling or equipment Both pin and socket components are packaged in standard EIA tape-and-reel formats for direct pick-up and placement Adapt with exist... |
|
| Read Full Story |
|
|
|
|
|
|
| Others, Packaging & Interconnect - 08 Nov 2004 |
|
| RFID Full 20" wide web process capability 12-micron placement repeatability +/- 3 sigma (process dependent) Passive or active designs Direct die pick from wafer down to .008" Capable of tape and reel ... |
|
| Read Full Story |
|
|
|
|
|
|
| Others, Packaging & Interconnect - 08 Nov 2004 |
|
| Camalot XyflexPro HVB Conveyorless material handling system and dual dispense heads Three-to-five times faster than conventional single lane systems Maximum dispense head utilization without requiring... |
|
| Read Full Story |
|
|
