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Sunday, October 12, 2008
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POLL
As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?
Yes, in the EMS space
Yes, in the ODM space
No, highly unlikely
View Results
 
 
 
 
 
 
PICK & PLACE   |   PAGE 2
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Universal Instruments Organizes Advanced SMT Lab Open Day

News, Pick & Place - 30 Jun 2008
With the miniaturization and growing complexity of electronics components, there are increasing applications of System-in-Package, flip chip, 0201/01005 SMT assembly and stacking technology in the man...
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MYDATA Acquires its German Distributor Royonic

News, Pick & Place - 04 Jun 2008
MYDATA has announced the acquisition of its German distributor Royonic. The company said it has a long standing and successful relationship with Royonic in the German SMT market and the acquisition re...
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Universal Instruments Launches a New-Generation, Low-Cost Surface Mount Platform in Asia

News, Pick & Place - 30 May 2008
Universal Instruments has recently launched the AdVantisX, a new-generation, low-cost surface mount platform in Asia. This new member of the AdVantis family, AdVantisX, is a platform targeting firmly ...
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Essemtec Appoints New Marketing Manager

News, Pick & Place - 16 May 2008
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that Florian Schildein has been its Marketing Manager since February 2008. Schildein studied Public Mana...
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Measurement Option Verifies Components Directly in the Placement Machine

News, Pick & Place - 14 May 2008
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has closed the last gap in the placement stage of surface mount devices. The new option, FLX-CVU...
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Samsung Techwin and Valor Form a Technology Partnership

News, Pick & Place - 07 May 2008
Samsung Techwin and Valor Computerized Systems Ltd announce the establishment of a technology partnership for integration of Samsung Techwin’s Pick & Place machine interfaces into Valor’s software pro...
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Samsung Techwin and Valor Form a Technology Partnership

Top News, Pick & Place - 07 May 2008
Samsung Techwin and Valor Computerized Systems Ltd announce the establishment of a technology partnership for integration of Samsung Techwin’s Pick & Place machine interfaces into Valor’s software pro...
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True parallel placement

Manufacturing Products & Equipment, Pick & Place - May 2008
A-Series • Multiple heads that place up to 121,000 components/hour (IPC9850 reference speed) with smooth robot movements and constant component monitoring • Single-digit defects per million performanc...
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Advanced placement system

Manufacturing Products & Equipment, Pick & Place - May 2008
CX-1 • Capable of placing advanced packages and features highaccuracy applications as well as standard SMT • Built on the base of a standard SMT machine, but with highly accurate glass linear encoder...
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Intelligent placement system

Manufacturing Products & Equipment, Pick & Place - May 2008
Flexys-10 • Well-suited for low- to mediumvolume high-mix production and NPI requirements • Eight-position rotary head with on-the-fly vision • Feeder capacity of 128 x 8mm tapes + 10 Matrix Tray loca...
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