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Sunday, October 12, 2008

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Current Issue

Adhesives/Coatings

Assembly Tools/Equipment

Cleaning Technology

Dispensing Technology

Identification Systems

Microelectronics/ Components

Optoelectronics/Storage

Packaging & Interconnect

PCB Production

Pick & Place

Programming

Rework & Repair

Software/Process Control Systems

Soldering Equipment

Soldering Materials

Stencil & Screen Printing

Supply Chain /Business

T&M/Inspection

September 2008 Issue

Highlights:

Efficient printing of flexible substrates

Right the first time

Thermal profiling: A key element of process control

Selecting the right cleaning process for your application

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As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?

Yes, in the EMS space

Yes, in the ODM space

No, highly unlikely

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	DEK to Hold Technology Day in Shenzhen

	Pan Pacific Microelectronics Symposium Program Announced

	BTU International to Exhibit at Solar Power International 2008

	IPC Releases Power Conversion Standard

	Universal Instruments Marked a New Milestone with the Shipment of the 1000th Lightning Head

	BEW 2008 to Highlight North China's Electronics Manufacturing Industry

	CTS Secures Next Generation Pedal Business with a Major Japanese Automotive Manufacturer

	Hon Hai to Lay Off 15 Percent of Manpower If Downturn Continues

	Arrow and Cree to Host Lighting Solution Seminar in Guangzhou, China

	Mouser Electronics Inks Distribution Agreement with Electronic Assembly GmbH

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